Packaging Materials R&D Engineer: Next-Gen Semiconductors

Monolithic Power Systems, Inc.

Hong Kong

On-site

HKD 600,000 - 900,000

Full time

14 days+
Application generator

A complete application in a minute — tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

Monolithic Power Systems, Inc. (MPS) is a leading semiconductor technology company focusing on integrated power semiconductors and systems power delivery architectures.

The candidate will drive innovation and performance improvements in key packaging materials, while developing 2nd source suppliers domestically to build a resilient, cost-effective supply chain for advanced packaging. The role demands a PhD in Materials Science or related field, deep polymer chemistry knowledge, and strong

Qualifications

  • PhD in Materials Science, Chemical Engineering, Polymer Science, Chemistry, or a closely related field.
  • Deep expertise in chemistry, formulation, processing, and failure modes of key packaging polymers.
  • Strong experience in material characterization techniques (TGA, DMA, rheology, etc.) and reliability testing (MSL, TCT, HAST, etc.).
  • Fluent in spoken and written English.

Responsibilities

  • Lead the research and development of next-generation packaging materials, including but not limited to: Epoxy die-attach adhesives, Molding compounds for fan-out, SiP, and other advanced packages, underfill materials.
  • Define material specifications, performance targets (thermal, mechanical, electrical, reliability), and qualification plans.
  • Conduct deep-dive technical analysis on material properties, failure mechanisms, and process compatibility.
  • Perform other tasks assigned by supervisor

Skills

Materials chemistry
Polymer formulations
Reliability testing

Education

PhD in Materials Science/Chemical Engineering/Polymer Science/C Chemistry

Tools

TGA
DMA
Rheology

Job description

Monolithic Power Systems, Inc. (MPS) is a leading semiconductor technology company focusing on integrated power semiconductors and systems power delivery architectures.

The candidate will drive innovation and performance improvements in key packaging materials, while developing 2nd source suppliers domestically to build a resilient, cost-effective supply chain for advanced packaging. The role demands a PhD in Materials Science or related field, deep polymer chemistry knowledge, and strong

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Next-Gen Packaging Materials R&D Engineer
Next-Gen Packaging Materials R&D Engineer

MPS Chengdu • Hong Kong

On-site
HKD 1,200,000 - 1,800,000
Package Material R&D Engineer (New Grad)
Package Material R&D Engineer (New Grad)

Monolithic Power Systems, Inc. • Hong Kong

On-site
HKD 600,000 - 900,000
Package Material R&D Engineer (New Grad)
Package Material R&D Engineer (New Grad)

Monolithic Power Systems • Hong Kong

On-site
HKD 850,000 - 1,500,000
Package Material R&D Engineer (New Grad)
Package Material R&D Engineer (New Grad)

MPS Chengdu • Hong Kong

On-site
HKD 1,200,000 - 1,800,000
Next-Gen Package R&D Engineer
Next-Gen Package R&D Engineer

Monolithic Power Systems • Hong Kong

On-site
HKD 600,000 - 900,000
Packaging Materials R&D Engineer — Epoxy & Molding
Packaging Materials R&D Engineer — Epoxy & Molding

Monolithic Power Systems • Hong Kong

On-site
HKD 850,000 - 1,500,000
Package R&D Engineer (New Grad)
Package R&D Engineer (New Grad)

Monolithic Power Systems, Inc. • Hong Kong

On-site
HKD 900,000 - 1,200,000
Package R&D Engineer (New Grad)
Package R&D Engineer (New Grad)

Monolithic Power Systems • Hong Kong

On-site
HKD 600,000 - 900,000
Package R&D Engineer (New Grad)
Package R&D Engineer (New Grad)

MPS Chengdu • Hong Kong

On-site
HKD 1,000,000 - 1,400,000
Power Packaging R&D Engineer
Power Packaging R&D Engineer

MPS Chengdu • Hong Kong

On-site
HKD 1,000,000 - 1,400,000