Next-Gen Package R&D Engineer

Monolithic Power Systems

Hong Kong

On-site

HKD 600,000 - 900,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

Monolithic Power Systems, Inc. is seeking an engineer to develop new package types and structures.

The role involves evaluating new materials, gathering requirements from multiple teams, and refining packaging roadmaps to support next-generation products. The ideal candidate holds a Doctorate with expertise in package or power electronics, understands supply chain dynamics, and communicates fluently in English.

Qualifications

  • Experience with package development principles and design rules.
  • Understanding of semiconductor supply chain and assembly/vendors.
  • Fluent in spoken and written English.

Responsibilities

  • Survey new materials for new package processes, reliability, and cost.
  • Collect packaging information from teams for next-gen package development.
  • Summarize package design experience and update roadmaps.
  • Perform other tasks as assigned by supervisor.

Skills

Package development principles
Semiconductor supply chain
Fluent in English

Education

Package or Power Electronics Major
Doctor's degree

Tools

AutoCAD
Cadence

Job description

Monolithic Power Systems, Inc. is seeking an engineer to develop new package types and structures.

The role involves evaluating new materials, gathering requirements from multiple teams, and refining packaging roadmaps to support next-generation products. The ideal candidate holds a Doctorate with expertise in package or power electronics, understands supply chain dynamics, and communicates fluently in English.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Power Packaging R&D Engineer
Power Packaging R&D Engineer

MPS Chengdu • Hong Kong

On-site
HKD 1,000,000 - 1,400,000
Package R&D Engineer (New Grad)
Package R&D Engineer (New Grad)

Monolithic Power Systems • Hong Kong

On-site
HKD 600,000 - 900,000
Package R&D Engineer (New Grad)
Package R&D Engineer (New Grad)

Monolithic Power Systems, Inc. • Hong Kong

On-site
HKD 900,000 - 1,200,000
Package R&D Engineer (New Grad)
Package R&D Engineer (New Grad)

MPS Chengdu • Hong Kong

On-site
HKD 1,000,000 - 1,400,000
Senior Package Development Engineer
Senior Package Development Engineer

Monolithic Power Systems, Inc. • Hong Kong

On-site
HKD 900,000 - 1,200,000
Packaging Materials R&D Engineer: Next-Gen Semiconductors
Packaging Materials R&D Engineer: Next-Gen Semiconductors

Monolithic Power Systems, Inc. • Hong Kong

On-site
HKD 600,000 - 900,000
Next-Gen Packaging Materials R&D Engineer
Next-Gen Packaging Materials R&D Engineer

MPS Chengdu • Hong Kong

On-site
HKD 1,200,000 - 1,800,000
Package Material R&D Engineer (New Grad)
Package Material R&D Engineer (New Grad)

MPS Chengdu • Hong Kong

On-site
HKD 1,200,000 - 1,800,000
Package Material R&D Engineer (New Grad)
Package Material R&D Engineer (New Grad)

Monolithic Power Systems • Hong Kong

On-site
HKD 850,000 - 1,500,000
Package Material R&D Engineer (New Grad)
Package Material R&D Engineer (New Grad)

Monolithic Power Systems, Inc. • Hong Kong

On-site
HKD 600,000 - 900,000