Package Material R&D Engineer (New Grad)

Monolithic Power Systems; Hong Kong; On-site; HKD 850,000 - 1,500,000; Full time

Job summary

Monolithic Power Systems, Inc. in Hong Kong seeks a highly qualified materials-science professional to drive innovation in packaging materials for advanced semiconductor packages.

You will develop and qualify 2nd source suppliers, ensuring resilience and cost-effectiveness in the supply chain. The role requires a PhD in a related field, deep polymer chemistry expertise, and strong experience with material characterization and reliability testing, plus fluent English.

Qualifications

• PhD in Materials Science, Chemical Engineering, Polymer Science, Chemistry, or related field.
• Deep expertise in chemistry, formulation, processing, and failure modes of key packaging polymers.
• Experience in material characterization techniques (TGA, DMA, rheology) and reliability testing (MSL, TCT, HAST).
• Fluent in spoken and written English.

Responsibilities

• Lead research and development of next-generation packaging materials (epoxy die-attach adhesives, molding compounds for fan-out, SiP, and advanced packages).
• Define material specifications, performance targets (thermal, mechanical, electrical, reliability) and qualification plans.
• Conduct deep-dive technical analysis on material properties, failure mechanisms, and process compatibility.
• Perform other tasks assigned by supervisor.

Skills

Fluent English

Education

PhD in Materials Science or related field

Tools

TGA

DMA

Rheology

Reliability testing (MSL, TCT, HAST)

Job description

Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are passionate about sustainability, and are committed to providing leading-edge products and innovation to our customers. Our portfolio of technology helps power our world ---come join our team and see how YOU can make a difference.

Job Description

• The candidate will drive innovation and performance improvement in key materials such as epoxy, molding compounds, and underfill materials.
• A main responsibility will be to develop and qualify 2nd source suppliers domestically, ensuring a resilient, cost-effective, and high-quality supply chain for advanced semiconductor packaging.

Responsibilities

• Lead the research and development of next-generation packaging materials, including but not limited to: Epoxy die-attach adhesives, Molding compounds for fan-out, SiP, and other advanced packages, underfill materials.
• Define material specifications, performance targets (thermal, mechanical, electrical, reliability), and qualification plans.
• Conduct deep-dive technical analysis on material properties, failure mechanisms, and process compatibility.
• Perform other tasks assigned by supervisor.

Qualifications

• PhD degree in Materials Science, Chemical Engineering, Polymer Science, Chemistry, or a closely related field.
• Deep expertise in chemistry, formulation, processing, and failure modes of key packaging polymers.
• Strong experience in material characterization techniques (TGA, DMA, rheology, etc.) and reliability testing (MSL, TCT, HAST, etc.).
• Fluent in spoken and written English

Monolithic Power Systems, Inc. (MPS) is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of MPS to provide equal opportunity to all qualified applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status or special disabled veteran, marital status, pregnancy, genetic information, or any other legally protected status.

Welcome to Monolithic Power Systems, Inc. Careers!

Monolithic Power Systems, Inc. (NASDAQ: MPWR) provides small, highly energy efficient, easy-to-use power solutions for systems found in industrial applications, telecom infrastructures, cloud computing, automotive, and consumer applications.