SiC Process Engineer: Laser Anneal & Backgrind Expert

vishay; Newport; On-site; GBP 60,000 - 85,000; Full time

Benefits offered by this job

Annual bonus

Medical cover

On-site restaurant

Free on-site parking

On-site fitness centre

Life assurance

Job summary

Vishay is seeking a SiC Process Engineer to drive development, qualification and industrialisation of Laser Anneal, Back Metal and Backgrind processes. You will own these modules, collaborate with R&D, Engineering, Production and Quality to deliver robust manufacturing systems and equipment for qualification, ramp‑up and sustained performance.

The role focuses on designing, qualifying and scaling SiC wafer fabrication processes, with emphasis on process controls, documentation and

Qualifications

• Bachelor's degree with at least five years of semiconductor process‑engineering or process‑development experience, or a Master/PhD with at least three years' experience.

Responsibilities

• Develop, qualify and optimise SiC wafer process modules with focus on Laser Anneal, Back Metal Deposition and Backgrind.
• Provide clear technical ownership of assigned processes and equipment sets.
• Plan and execute major process development and integration projects.
• Design experiments and analyse process, metrology and electrical data.
• Define, document and maintain process specifications and control plans.
• Support transfer of new technologies from R&D into manufacturing, including qualification.
• Identify and implement improvements to capability, yield, quality, cycle time and equipment utilisation.
• Establish robust process-control strategies with inline measurements and SPC charts.

Skills

SiC wafer fabrication

Process development

SPC (statistical process control)

Data analysis

Cross-functional collaboration

Technical communication

Process ownership

Problem solving

Education

Bachelor's degree in Electrical Engineering, Materials Science, Physics, Chemistry or related

Master's degree or PhD in a relevant discipline

Job description

Vishay is seeking a SiC Process Engineer to drive development, qualification and industrialisation of Laser Anneal, Back Metal and Backgrind processes. You will own these modules, collaborate with R&D, Engineering, Production and Quality to deliver robust manufacturing systems and equipment for qualification, ramp‑up and sustained performance.

The role focuses on designing, qualifying and scaling SiC wafer fabrication processes, with emphasis on process controls, documentation and