Senior NPI Packaging Engineer

IC Resources; Bristol; On-site; GBP 70,000 - 95,000; Full time

Job summary

IC Resources is seeking a Senior NPI Packaging Engineer to lead development of advanced semiconductor packaging solutions, guiding product lifecycle from concept to manufacturing handover.

You will work with global internal teams and OSAT partners to deliver reliable, scalable, and cost-effective packaging, including wirebond, flip-chip, DFN/QFN, BGA, and SiP.

The role emphasizes strong ownership, cross-functional communication, and keeping up with industry advances in packaging technologies.

Qualifications

• Master’s degree or higher in Electronics, Physics, Materials Science, Engineering, or related field.
• ~6 years’ experience in semiconductor packaging/NPI development.
• Strong knowledge of semiconductor assembly processes and package technologies.
• Experience with supplier design rules and 3D CAD tools (e.g., AutoCAD).
• Understanding of package thermal characterization.
• Ability to work with global cross-functional teams and external partners.
• Strong ownership, communication, and technical presentation skills.

Responsibilities

• Develop and optimize advanced semiconductor packages (wirebond, flip-chip, embedded, DFN/QFN, BGA, SiP, WLCSP).
• Evaluate packaging technologies and drive supplier/manufacturing partner development.
• Design packages to meet electrical, thermal, and form-factor requirements, including back-end wafer process considerations.
• Improve packaging design processes, tools, and methodologies for efficient NPI delivery.
• Support validation, testing, customer requirements, package drawings, thermal models, and technical documentation.
• Analyze assembly data and communicate technical findings.
• Maintain awareness of industry and academic developments in semiconductor packaging.

Skills

Semiconductor packaging

NPI development

3D CAD tools

Thermal analysis

Cross-functional teamwork

Technical presentation

Education

Master’s degree in Electronics/Engineering/Physics/Materials Science

Tools

AutoCAD

Cadence Allegro X APD

KLayout

Job description

Our international client is currently searching for a Senior NPI Packaging Engineer to lead the development of advanced semiconductor packaging solutions, managing the full product lifecycle from package concept and technology selection through design, validation, qualification, and manufacturing handover. Working closely with global internal teams and OSAT partners to deliver reliable, scalable, and cost-effective packaging solutions will be required.

Key Responsibilities

• Develop and optimize advanced semiconductor packages (wirebond, flip-chip, embedded, DFN/QFN, BGA, SiP, WLCSP).
• Evaluate packaging technologies and drive supplier/manufacturing partner development.
• Design packages to meet electrical, thermal, and form-factor requirements, including back-end wafer process considerations.
• Improve packaging design processes, tools, and methodologies for efficient NPI delivery.
• Support validation, testing, customer requirements, package drawings, thermal models, and technical documentation.
• Analyze assembly data and communicate technical findings.
• Maintain awareness of industry and academic developments in semiconductor packaging.

Requirements

• Master’s degree or higher in Electronics, Physics, Materials Science, Engineering, or related field.
• ~6 years’ experience in semiconductor packaging/NPI development.
• Strong knowledge of semiconductor assembly processes and package technologies.
• Experience with supplier design rules and 3D CAD tools (e.g., AutoCAD).
• Understanding of package thermal characterization.
• Ability to work with global cross-functional teams and external partners.
• Strong ownership, communication, and technical presentation skills.

Preferred Experience

• 3D multiphysics simulation tools (Cadence, ANSYS, or equivalent).
• Package reliability/qualification testing (MSL, TC, HAST, HTS, JEDEC standards).
• Structured problem-solving methods (8D, DOE).
• Package layout tools such as Cadence Allegro X APD and Klayout.