Senior Analog PCB Design Engineer — Photonics Interfaces

MAI Agents; Oxford; Presencial; GBP 70.000 - 110.000; Jornada completa

Descripción de la vacante

Lumai, an Oxford-based optical compute company, seeks a senior board-level analog/mixed-signal engineer to own photonic interfaces from spec to production. You will design photodiode front ends, TIAs, ADC/DAC drivers and bias networks, ensuring noise, bandwidth and linearity targets are met.

You will collaborate across optics, photonics and system teams, shaping layouts, test procedures and production-readiness for next‑gen AI hardware.

Formación

• Degree in electronics or related discipline with production-grade analog/mixed-signal experience.
• Strong analog fundamentals: op-amp design, noise, stability, filtering.
• Hands-on experience with TIAs and low-noise, high-bandwidth front ends.
• Experience interfacing high-performance ADCs and DACs, driver design and filtering.
• Solid knowledge of low-noise power supply design, grounding and partitioning.

Responsabilidades

• Design board-level analog and mixed-signal circuits connecting electronics to light.
• Translate photonic requirements into analog specifications with photonics/system teams.
• Design low-noise power delivery, references and grounding schemes.
• Develop control loops for photonic components and heater/drivers.
• Run SPICE/noise/stability analyses and verify across corners.
• Provide placement, routing and grounding guidance for layouts.
• Lead lab bring-up and characterize analog circuits, correlate with simulations.
• Collaborate with ASIC team on chip-to-board interfaces.

Descripción del empleo

Lumai, an Oxford-based optical compute company, seeks a senior board-level analog/mixed-signal engineer to own photonic interfaces from spec to production. You will design photodiode front ends, TIAs, ADC/DAC drivers and bias networks, ensuring noise, bandwidth and linearity targets are met.

You will collaborate across optics, photonics and system teams, shaping layouts, test procedures and production-readiness for next‑gen AI hardware.