RF Process Engineer: Die Attach & Wire Bonding

Filtronic; Sedgefield; In loco; GBP 60.000 - 80.000; Tempo pieno

Descrizione del lavoro

Filtronic PLC is expanding its Process Engineering team at NetPark to scale advanced packaging and assembly of RF modules. The Process Engineer will evaluate, develop, optimise and control die attach and wire bonding processes, ensuring manufacturability and high yield for future products.

You will collaborate with RF, mechanical and operations teams, define tooling and automation needs, run feasibility trials, and drive continuous improvement through SPC, DMAIC and robust validation.

Competenze

• Degree in Engineering, Materials Science, Physics or related discipline.
• Experience in semiconductor or RF module assembly processes.
• Hands-on experience with die attach and wire bonding.
• Understanding of materials behaviour, intermetallic formation and thermal management.
• Experience with process validation and statistical analysis tools.
• Strong problem-solving capability in a manufacturing environment.

Mansioni

• Partner with RF Engineering to identify suitable materials, processes and assembly technologies aligned to future product requirements.
• Evaluate emerging die attach and interconnect technologies to support higher power density, higher frequencies and improved thermal performance.
• Provide early manufacturability input into technology roadmap planning.
• Assess scalability, automation potential and cost implications of proposed technologies.
• Lead feasibility trials and proof-of-concept builds for next-generation processes.
• Support make/buy decisions and supplier technology assessment.
• Develop die attach methods including silver epoxy, silver sintering, and eutectic attach; define process windows and validation methodologies.

Conoscenze

Analytical thinking

Cross-functional collaboration

Roadmap translation

Manufacturing experience

Problem solving

Formazione

Degree in Engineering, Materials Science, Physics or related discipline

Strumenti

Statistical analysis tools

Descrizione del lavoro

Filtronic PLC is expanding its Process Engineering team at NetPark to scale advanced packaging and assembly of RF modules. The Process Engineer will evaluate, develop, optimise and control die attach and wire bonding processes, ensuring manufacturability and high yield for future products.

You will collaborate with RF, mechanical and operations teams, define tooling and automation needs, run feasibility trials, and drive continuous improvement through SPC, DMAIC and robust validation.