RF Packaging & Die-Attach Process Engineer

Filtronic Plc; Sedgefield; On-site; GBP 50,000 - 70,000; Full time

Job summary

Filtronic plc, a world leader in customised microwave and millimetre wave electronics, seeks a Process Engineer to develop and control advanced semiconductor and RF assembly processes. You will advance die attach methods and wire bonding while collaborating with RF engineering to mature manufacturing technologies for scalable, reliable products.

The role focuses on die attach variants (silver epoxy, silver sinter, eutectic) and gold wire bonding, balancing manufacturability, quality and cost in

Qualifications

• Degree holder in Engineering or related discipline.
• Experience in semiconductor/RF module assembly or similar.
• Hands-on in die attach and wire bonding processes.

Responsibilities

• Partner with RF Engineering to align materials and assembly tech with future products.
• Evaluate and qualify die attach and interconnect technologies for higher power density and better thermal performance.
• Lead feasibility trials, pilot builds and transition to scalable manufacturing.
• Define process windows, qualification plans and validation methodologies.
• Drive continuous improvement in yield, cycle time and cost for new products.

Skills

Die attach processes

Wire bonding

Manufacturing process development

NPI experience

Statistical analysis

Education

Bachelor's degree in Engineering or related

Tools

JEDEC standards knowledge

Process validation tools (DOE/8D)

Job description

Filtronic plc, a world leader in customised microwave and millimetre wave electronics, seeks a Process Engineer to develop and control advanced semiconductor and RF assembly processes. You will advance die attach methods and wire bonding while collaborating with RF engineering to mature manufacturing technologies for scalable, reliable products.

The role focuses on die attach variants (silver epoxy, silver sinter, eutectic) and gold wire bonding, balancing manufacturability, quality and cost in