Microelectronics Process Engineer: Wire Bonding & Die Attach

TT Electronics; Bedlington; On-site; GBP 42,000 - 59,000; Full time

Benefits offered by this job

Enhanced pension contributions

Healthcare cashback plan

Employee assistance programme

Site incentive plan

5 weeks annual leave

Job summary

TT Electronics Bedlington is seeking a Process Engineer to join the Engineering team in the Chip and Wire Assembly function. The role drives continuous improvement across die attach, wire bonding, encapsulation, and related assembly operations to ensure product quality, yield, and reliability meet stringent industry standards.

The successful candidate will lead cross-functional collaboration with production, quality, and equipment engineering, introducing new products, resolving process issues,

Qualifications

• A degree in a relevant engineering discipline or equivalent experience.

Responsibilities

• Day to day support of production, troubleshooting issues with manufacturing equipment in a timely manner.
• Developing and optimising processes in the manufacture of microelectronics products.
• Pro-actively identify opportunities to improve yield and manufacturing efficiency to instigate and support continuous improvement activities.
• Commissioning and qualifying new manufacturing equipment.
• Producing technical documentation, such operating instructions, inspection standards and PFMEAs.
• Supporting the transition of products from NPI to production.
• Provide training and support to engineers and production operators.
• Gain and maintain detailed knowledge of the production process and equipment.
• Liaising with customers and suppliers.
• Ensure safe working practices are adopted and health and safety legislation are adhered to when implementing new products, materials processes, or equipment

Skills

Metallurgy knowledge

Adhesives knowledge

Wire bonding expertise

Lean 8D DOE

Problem solving

Communication skills

Planning & organisation

Teamwork

Education

Bachelor's degree in Engineering

Tools

MS Office

Job description

TT Electronics Bedlington is seeking a Process Engineer to join the Engineering team in the Chip and Wire Assembly function. The role drives continuous improvement across die attach, wire bonding, encapsulation, and related assembly operations to ensure product quality, yield, and reliability meet stringent industry standards.

The successful candidate will lead cross-functional collaboration with production, quality, and equipment engineering, introducing new products, resolving process issues,