Process Technician: Metal Deposition & Wafer Thinning

Huawei Technologies Research & Development (UK) Ltd; Ipswich; On-site; GBP 26,000 - 36,000; Full time

Job summary

Huawei Research and Development UK Limited is seeking a Process Engineering Technician to join the Fab Engineering team. The role focuses on processing semiconductor wafers, supporting metal deposition and wafer thinning, and delivering robust, stable processes for R&D projects and high-volume manufacturing.

The position is primarily cleanroom-based, with hands-on operation across equipment and processes, plus some support in adjacent cells. Two rotating shifts, 37.5 hours per week.

Qualifications

• Good manual dexterity for handling semiconductor wafers and samples.
• Science-based education background or relevant previous experience in Cleanroom or Lab environments.
• Knowledge and experience of SPC processes and Six Sigma techniques.
• Working knowledge of MES and general office and data software – e.g., MS Word, Excel.

Responsibilities

• Run day-to-day operations on metal deposition and wafer thinning equipment.
• Process R&D and manufacturing wafers following guidance from Engineers and Architects.
• Serve as main contact between Cell Engineers and Maintenance, providing hands-on support for preventive maintenance and tool upkeep.
• Manage SPC data collection by ensuring test materials are ready and routine checks are completed on time.
• Bridge communication between Manufacturing and Process Engineering when tool/process faults occur to minimise downtime.
• Assist in returning tools and processes to production after maintenance or downtime.

Skills

Manual dexterity

Cleanroom/Lab experience

SPC & Six Sigma knowledge

MS Word/Excel proficiency

Education

Science-based education background

Tools

MES

MS Word

Excel

Job description

Huawei Research and Development UK Limited is seeking a Process Engineering Technician to join the Fab Engineering team. The role focuses on processing semiconductor wafers, supporting metal deposition and wafer thinning, and delivering robust, stable processes for R&D projects and high-volume manufacturing.

The position is primarily cleanroom-based, with hands-on operation across equipment and processes, plus some support in adjacent cells. Two rotating shifts, 37.5 hours per week.