Principal Semiconductor Packaging Engineer

JR United Kingdom; Liverpool; On-site; GBP 45,000 - 75,000; Full time

Job summary

A leading company in Liverpool is seeking a Principal Semiconductor Packaging Engineer to guide their packaging roadmap. The successful candidate will work on the development of quantum processor packaging, including wirebond techniques and photonics packaging methods, ensuring optimal thermal performance. Strong communication skills and experience with external suppliers are essential.

Qualifications

• Experience of semiconductor/photonic packaging methods.
• Knowledge of package substrate technologies.
• Experience working with 3rd party suppliers.

Responsibilities

• Developing wirebond and bumping methods.
• Supervising failure analysis experiments.
• Designing packaging methods for thermal performance.

Skills

Semiconductor packaging methods

Die bonding methods

Communication skills

Job description

Social network you want to login/join with:

Principal Semiconductor Packaging Engineer, liverpool

col-narrow-left

Client:

IC Resources

Location:

liverpool, United Kingdom

Job Category:

Other

-

EU work permit required:

Yes

col-narrow-right

Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

col-wide

Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.