Principal Semiconductor Packaging Engineer

JR United Kingdom; Warrington; On-site; GBP 50,000 - 75,000; Full time

Job summary

A leading edge company is seeking a Principal Semiconductor Packaging Engineer to lead the packaging roadmap for quantum processor devices. This role involves developing innovative photonic and semiconductor packaging methods, working closely with suppliers and internal teams to ensure high-performance standards. The ideal candidate will possess strong communication skills and extensive experience in semiconductor packaging.

Qualifications

• Experience in semiconductor and photonic packaging methods.
• Knowledge of die bonding techniques for thermal and mechanical performance.
• Experience with 3rd party suppliers is essential.

Responsibilities

• Steer the packaging roadmap for quantum processor devices.
• Design and supervise failure analysis experiments.
• Develop wirebond and bumping methods.

Skills

Semiconductor packaging methods

Photonics packaging methods

Die bonding methods

Communication skills

Job description

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Principal Semiconductor Packaging Engineer, warrington, cheshire

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Client:

IC Resources

Location:

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.