Principal RF Design Engineer

Sequans Communications

Greater London

On-site

GBP 120,000 - 160,000

Full time

9 days ago
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Job summary

Sequans Communications is seeking a Principal-level RFIC design engineer to join a dynamic RFIC design team. You will lead the specification, design and verification of key circuits and sub-systems for next generation 5G wireless transceivers, and mentor junior engineers.

You will collaborate with Software, Signal Processing, Product Integration, Sales & Marketing to drive design execution and ensure manufacturability on cutting‑edge nanometer RF‑CMOS processes, across European design centers.

Qualifications

  • Engineering degree; MSc or PhD preferred
  • 15+ years’ IC development experience
  • RFIC contributions on broadband wireless transceivers (WiFi/LTE) on nanometer RF-CMOS processes
  • Understanding of low power/low noise analog/RF design techniques
  • DFM considerations for cutting-edge processes
  • RF and baseband layout techniques
  • Experience mentoring and directing others

Responsibilities

  • Specify, design and verify key circuits and sub-systems of integrated RF transceivers
  • Collaborate with Software, Signal Processing, Product Integration, Sales & Marketing to enable design and production
  • Provide broad technical expertise and mentor junior engineers within the team

Skills

Multi-band RF circuit design
Cadence tools
RF lab equipment familiarity
Mentoring teammates
Cross-functional collaboration

Education

MSc or PhD in relevant discipline
Bachelor’s degree in related field

Tools

Cadence
RF test equipment
Lab instruments

Job description

We are searching for a Principal-level radio frequency integrated circuit (RFIC) design engineer to join and work within a dynamic RFIC design team. You will participate in the development of next generation RFIC products for 5G wireless communication networks.

RESPONSIBILITIES:
  • Specify, design and verify key circuits and sub-systems of integrated RF transceivers
  • Work closely with other teams to facilitate the design and production process, e.g. Software, Signal Processing, Product Integration, Sales & Marketing
  • Provide broad technical expertise and mentor junior engineers within the team
PROFILE:
  • Highly motivated, pro-active self-starter
  • Strong sense of ownership and responsibility
  • Creative thinker with strong problem-solving skills
  • Team oriented attitude
  • Ability to thrive in a multicultural environment
  • Ability to communicate well with cross-functional teams
  • Willingness to travel periodically between design centers in Europe
  • Excellent written and oral communications skills in English
  • Ability to communicate with remote design centers
REQUIRED EXPERIENCE:
  • Engineering degree in a relevant discipline. MSc or equivalent, Ph.D. preferred
  • 15 or more years’ experience of relevant IC development
  • Recent successful RFIC project contributions on highly integrated RF transceivers, ideally related to broadband wireless communication systems, e.g. WiFi or LTE, on a nanometer scale RF-CMOS technology
  • Understanding of low power/low noise design techniques for Analog and RF
  • Knowledge of Design for Manufacture considerations on cutting edge processes
  • Full appreciation of RF and baseband layout techniques
  • Significant experience planning and tracking your own and others’ work, and mentoring and directing others
REQUIRED DETAILED KNOWLEDGE AT CIRCUIT LEVEL:
  • Multi-band RF circuit design in the 700MHz to 5GHz range
  • Proficiency in Cadence frontend and backend tools is absolutely required
  • Familiarity with RF lab equipment such as signal generators, spectrum analyzers, and vector signal analyzers is required
PREFFERED DETAILED KNOWLEDGE AT SYSTEM LEVEL:
  • RFIC system and architecture design, ideally for OFDM applications
  • RFIC sub-system and block level definition & specification
  • Integrated single chip RF + Digital baseband projects
  • Top level chip simulation and functional verification
  • Mixed-mode simulation environments (e.g. mixed verilog and device level)
  • Direct conversion Rx and Tx architectures and associated considerations
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