Lead Engineer - Body Electronics

Tata Technologies Ltd.; Woking; On-site; GBP 75,000 - 90,000; Full time

Job summary

Tata Technologies Ltd. is seeking a Body Electronics Lead Engineer to join the Embedded Systems Solutions team, working on systems for future McLaren sports cars.

You will define a technology roadmap and drive development through the lifecycle from concept to production. The role requires a hands-on, collaborative engineer with strong ASPICE discipline, DFMEA experience, and the ability to liaise with cross-functional teams in a fast-paced environment.

Qualifications

• Experience with automotive ASPICE process framework.
• Strong systems and software engineering background.
• Hands-on, detail-oriented team player with collaborative mindset.

Responsibilities

• System and components specifications
• DFMEA
• BoM management and Engineering release (SAP Structuring & Releases)
• Validation planning (DVP)
• Test specifications
• Timing plan and project management
• Interface on CAN/LIN or Ethernet
• Root Cause analysis (SW and HW) and Systems sign-off
• Attributes delivery
• Component functional testing & calibration
• Supplier Management, Component suppliers
• Define Scope of change, Software requirements and ARXML changes
• SW Validation
• Definition of ECU Pin-outs, Connector & Harness Definition
• Manage localization plan for new regions
• Update and maintain test tool and test scripts
• Costing & Budget planning - HW
• Define and maintain component time plan (HW & SW)
• Define EOL Configuration
• Technology Road map for next Gen HW
• HW samples for build readiness (Manage/Order and update HW Units)
• Package Clearance and Serviceability, Assembly Sequence (Vehicle Assembly)
• Brackets Management
• Cost / weight reduction ideas
• PPAP
• Certification
• Plant Issue Investigation
• Warranty Claim Investigation

Job description

Body Electronics Lead Engineer

Our Embedded Systems Solutions department (ESS) encompasses all activities outlined under the Automotive SPICE (ASPICE) process framework, including systems engineering, software engineering, coding, and all levels of functional testing. Beyond core development, ESS also integrates critical supporting processes such as project management, risk assessment, functional safety, and cybersecurity, ensuring compliance with ASPICE standards and delivering reliable, secure, and high-quality embedded systems & solutions.

Role Description

Body Electronics Lead Engineer

Our Embedded Systems Solutions department (ESS) encompasses all activities outlined under the Automotive SPICE (ASPICE) process framework, including systems engineering, software engineering, coding, and all levels of functional testing. Beyond core development, ESS also integrates critical supporting processes such as project management, risk assessment, functional safety, and cybersecurity, ensuring compliance with ASPICE standards and delivering reliable, secure, and high-quality embedded systems & solutions.

The Role

As a member of the Body Electronics team, you will be part of a core systems design & development team focused on systems for future McLaren sports cars. You will be responsible for identifying future technology, defining a technology roadmap and following that roadmap, developing technology through the engineering lifecycle, into production.

The position requires a highly motivated and hands-on team player with exceptional attention to detail, diligence, and a positive attitude. The fast-paced development and bespoke target platform provides a challenging environment suited to an engineer who can quickly develop skills in new areas and liaise with other engineering teams within a multidisciplinary environment. Our customers expect high standards, and we require team capable of meeting such demands.

Area of Responsibility

• System and components specifications
• DFMEA
• BoM management and Engineering release (SAP Structuring & Releases)
• Validation planning (DVP)
• Test specifications.
• Timing plan and project management
• Interface on CAN/LIN or Ethernet
• Root Cause analysis (SW and HW) and Systems sign-off
• Attributes delivery
• Component functional testing & calibration.
• Supplier Management, Component suppliers
• Define Scope of change, Software requirements and ARXML changes
• SW Validation
• Definition of ECU Pin-outs, Connector & Harness Definition
• Manage localization plan for new regions
• Update and maintain test tool and test scripts
• Costing & Budget planning - HW
• Define and maintain component time plan (HW & SW)
• Define EOL Configuration
• Technology Road map for next Gen HW
• HW samples for build readiness (Manage/Order and update HW Units)
• Package Clearance and Serviceability, Assembly Sequence (Vehicle Assembly)
• Brackets Management
• Cost / weight reduction ideas
• PPAP
• Certification
• Plant Issue Investigation
• Warranty Claim Investigation