Graduate MEMS Packaging Engineer

JR United Kingdom; Shrewsbury; On-site; GBP 25,000 - 35,000; Full time

Job summary

A technology startup in Shrewsbury is seeking a Graduate MEMS Packaging Engineer. This position offers recent graduates the opportunity to work on hands-on projects in MEMS packaging, enhancing their practical skills while being part of a dynamic team focused on high-impact technologies. Successful candidates will have a relevant engineering degree and problem-solving skills.

Qualifications

• Graduate in Electronics, Mechanical Engineering, or related discipline.
• Strong understanding of DOE and basic statistics.
• Exposure to semiconductor packaging or MEMS is beneficial.

Responsibilities

• Support development of MEMS and antenna subassembly packaging processes.
• Conduct lab-based tests and execute reliability tests.

Skills

Engineering principles

Problem-solving

Semiconductor packaging

MEMS technologies

RF technologies

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Graduate MEMS Packaging Engineer, Shrewsbury

Client: IC Resources

Location: Shrewsbury, United Kingdom

Job Category: Other

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EU work permit required:

Yes

Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

Job Description:

Our Edinburgh-based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role involves supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab-based tests and participating in the design and execution of reliability tests will be key responsibilities.

Required skills for the Graduate MEMS Packaging Engineer include:

• Strong understanding of fundamental engineering principles (DOE, basic statistics)
• Problem-solving mindset
• Exposure to semiconductor packaging, MEMS, or RF technologies is beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline

Please contact Rachel Anderson for further details.