Graduate MEMS Packaging Engineer

JR United Kingdom; Telford; On-site; GBP 25,000 - 35,000; Full time

Job summary

A leading technology startup is looking for a Graduate MEMS Packaging Engineer to join their Operations team in Telford. This role offers recent graduates the chance to gain hands-on experience in a dynamic environment, focusing on MEMS and antenna packaging processes. Ideal candidates will have a background in engineering and a problem-solving mindset, eager to contribute to innovative projects.

Qualifications

• Recent graduate with a degree in Electronics, Mechanical Engineering, or related field.
• Strong grasp of fundamental engineering principals.
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial.

Responsibilities

• Support development of MEMS and antenna subassembly packaging processes.
• Conduct lab-based tests and participate in design and execution of reliability tests.

Skills

Engineering Principles

Problem Solving

Semiconductor Packaging

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Client:

IC Resources

Location:

telford, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.