Senior ASIC Architect — AI Compute & SoC Visionary

Arago

Paris

Sur place

EUR 140 000 - 210 000

Plein temps

14 jours+
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Avantages offerts par ce poste

Stock option plan
Relocation support
Healthcare coverage
Pension contributions

Résumé du poste

Arago, an AI and computer hardware company, seeks a senior architect to define and realize next‑generation compute architectures, guiding cross‑functional teams from concept to production.

You will own the top‑level architecture of Arago’s multiphysics compute platform and collaborate across RTL, verification, packaging, and software to ensure scalable, high‑performance, reliable silicon solutions.

Qualifications

  • Proven track record in architecting complex, high‑performance digital systems.
  • Deep expertise in memory hierarchies, interconnects, and trade‑offs.
  • Hands‑on with vector ALUs, SIMD, systolic arrays, and custom datapaths.
  • Leading full ASIC development from concept to tape‑out.
  • Experience with HBM, chiplets, 2.5D/3D packaging and their impact.
  • Strong leadership and cross‑functional alignment skills.

Responsabilités

  • Carry the top‑level architecture of Arago’s multiphysics compute platform.
  • Own the architectural vision from concept through tape‑out and handoff.
  • Mentor cross‑functional hardware teams across RTL, verification, and physical integration.
  • Collaborate with software, packaging, and system integration to ensure scalability and reliability.
  • Evaluate new directions, develop performance and cost models, guide prototyping to de‑risk innovations.

Connaissances

High‑performance architectures
Computer architecture
Vector engines
ASIC development cycles
System integration
Leadership & vision

Description du poste

Arago, an AI and computer hardware company, seeks a senior architect to define and realize next‑generation compute architectures, guiding cross‑functional teams from concept to production.

You will own the top‑level architecture of Arago’s multiphysics compute platform and collaborate across RTL, verification, packaging, and software to ensure scalable, high‑performance, reliable silicon solutions.

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