Remote Quantum 3D Integration Engineer

Alice & Bob

Paris

Hybride

EUR 90 000 - 120 000

Plein temps

Il y a 5 jours
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Avantages offerts par ce poste

BSPCE plan
Direct IP bonuses
Flexible remote policy up to 40%
Parental plan with crèche support
Urban Sports Club
Mental health support
25 days vacation + RTT
Transport cost coverage
Health coverage with Alan
Meal vouchers Swile
French language courses

Résumé du poste

Alice & Bob in Paris is building the first universal, fault-tolerant quantum computer. The role sits at the crossroads of nanofabrication, assembly, and scalable QPU design.

You'll work hand in hand with teams across our hardware organization—from roadmap definition to fabrication, packaging, and validation—to build 3D integration technologies that will power the next generation of quantum processors. This position requires a PhD or MSc in a related field, 3+ years in 3D integration, and a track

Qualifications

  • PhD or MSc in physics, materials science, electrical engineering, or microelectronics
  • 3+ years of demonstrated 3D integration experience in flip-chip / bump bonding and TSV processing
  • Experience developing and qualifying an integration process brick end to end
  • Strong grounding in failure analysis and reliability assessment of 3D interconnects
  • Understanding of superconducting QPU fabrication and cryogenic operation demands is a plus

Responsabilités

  • Explore, identify, and benchmark 3D assembly technologies for QPUs considering material, microwave performance, and cryogenic reliability
  • Develop and qualify core 3D integration building blocks (airbridge, flip-chip bonding, TSV, MLW, interconnects) with fabrication/packaging teams
  • Design and drive integration test plans with cross-functional teams
  • Build scalable, well-documented integration procedures for company growth
  • Investigate integration issues and drive root-cause analyses ensuring alignment with specs and targets
  • Be the technical contact for 3D integration with external foundries and packaging vendors

Connaissances

Hands-on cleanroom experience
3D integration expertise
Failure analysis
Cross-functional collaboration
Problem solving

Formation

PhD in physics or materials science

Outils

SEM
X-ray inspection / tomography
Profilometry
Wafer-level assembly

Description du poste

Alice & Bob in Paris is building the first universal, fault-tolerant quantum computer. The role sits at the crossroads of nanofabrication, assembly, and scalable QPU design.

You'll work hand in hand with teams across our hardware organization—from roadmap definition to fabrication, packaging, and validation—to build 3D integration technologies that will power the next generation of quantum processors. This position requires a PhD or MSc in a related field, 3+ years in 3D integration, and a track

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