Packaging and PCB Board Design Engineer

JR France; Auvergne-Rhône-Alpes; Sur place; EUR 40 000 - 60 000; Plein temps

Résumé du poste

Une entreprise dynamique dans le secteur de la technologie quantique recherche un ingénieur en conception de circuits imprimés pour faire partie de l'équipe d'intégration. Le candidat idéal aura une solide expérience en conception RF et travaillera sur des projets passionnants liés à l'innovation dans le domaine des processeurs quantiques. En rejoignant notre équipe à Grenoble, vous contribuerez au succès de collaborations industrielles majeures et travaillerez dans un environnement transparent et autonome.

Qualifications

• Expérience en conception de PCB pour applications RF jusqu'à 20 GHz.
• Connaissance d'environnements cryogéniques (1K) souhaitée.
• Habitude de travailler avec des réseaux d'adaptation et des stratégies d'intégrité de signal.

Responsabilités

• Développer et concevoir des circuits imprimés en fonction des spécifications des puces.
• Proposer des solutions d'emballage pour les puces Qubit.
• Collaborer avec des équipes techniques sur des projets innovants.

Connaissances

Conception de circuits imprimés RF

Analyse S-parameter

Simulation RF

Gestion thermique

Formation

Diplôme en électronique ou domaine connexe

Outils

Outils de conception de PCB

Équipements de test RF

Description du poste

Packaging and PCB Board Design Engineer, Auvergne-Rhône-Alpes

Client:

Quobly

Location:

Auvergne-Rhône-Alpes

Job Category:

Other

EU work permit required:

Yes

Job Reference:

292912170106722713632760

Job Views:

2

Posted:

24.06.2023

Expiry Date:

08.08.2023

Job Description:

Quobly aims to have a strong impact on society by providing cost-effective universal quantum processors to solve currently unsolvable problems.

Founded in 2022, Quobly is a fast-growing start-up located in Grenoble's vibrant and multidisciplinary ecosystem. The company relies on the CNRS Neel Institute and CEA-Leti and benefits from the dynamic of strong links between research and industry.

Quobly is looking to grow its team on the Packaging and PCB board design for its chip beyond 100 Qubit design.

The goal is to design, develop, and subcontract PCB board fabrication, taking into account the specific requirements of the chip.

The requirements are related to RF signal integrity, thermal management, and the cryogenic environment in which the chips operate.

What awaits you every day at Quobly within the Integration Team:

• You will develop, design, and subcontract PCB boards based on the specifications of the chip.
• You will define and propose semiconductor packaging solutions for the Qubit chip.
• You will propose PCB partitioning to find the best compromise between testability and versatility.
• Collaborate with and learn from talented people from many countries and backgrounds (software, hardware design, quantum physics, characterization, measurement, quantum information theory) in a culture of transparency and autonomy.
• Work hand in hand with members of our technical teams.
• Contribute to the success of the industrial collaborations with CEA, CNRS, and STMicroelectronics.

You are special because:

• You have experience in designing PCBs for RF applications up to 20 GHz, including impedance-controlled traces, RF shielding, ground plane strategies, and signal integrity.
• You have experience with matching networks and S-parameter analysis.
• You are experienced with RF simulation tools and PCB design tools.
• You have experience with typical semiconductor packaging (preferred).
• You have experience with thermal management at the package and board level (a plus).
• You are familiar with RF test equipment such as VNA, spectrum analyzer, signal generator, etc.
• You have knowledge of cryogenic (1K) environments.

If you’re missing some skills but have a strong background, drive, and adaptability, we encourage you to apply! Your expertise and proactive approach can make a real difference.