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An innovative firm in Grenoble is seeking a Photonics Packaging Engineer to join their silicon photonic chip packaging team. This exciting role involves designing advanced packaging solutions for silicon photonic ICs, taking them from design to mass production. You will also be responsible for identifying and managing subcontractors while ensuring that customer product requirements are met. If you have a strong background in micro-optical and semiconductor assembly processes and are passionate about contributing to cutting-edge technology, this opportunity could be perfect for you.
Our Grenoble based client is currently searching for a Photonics Packaging Engineer to join the silicon photonic chip packaging team. The role will involve designing advanced packaging solutions for silicon photonic ICs and taking them from design to mass production. Identifying and managing subcontractors will be an important part of the role, as well as interaction with customers to ensure product requirements are met.
Please contact Rachel Anderson for further details.
Location: Grenoble, Rhone-Alpes, France