Cryogenic Photonics Packaging Engineer - Hybrid & Benefits

Quandela; Massy; Hybrid; EUR 70,000 - 110,000; Full time

Benefits offered by this job

Company savings plan

100% health coverage (Alan)

50% transport reimbursement or bonus

Meal vouchers (Swile)

Gymlib fitness support

Childcare assistance & referral bonus

Job summary

Quandela is seeking a Photonics Packaging & Cryogenic Integration Engineer to advance the integration of single-photon sources, photonic ICs, and optical components into fully integrated systems. You will design packaging solutions, develop cryogenic setups, and contribute to automation of alignment and testing, pushing toward industrial-scale production.

You will combine optics, electronics, mechanics, and software to create robust prototypes, work with CAD tools, and document processes for

Qualifications

• PhD in electrical engineering, mechanical engineering, applied physics, or related field.
• Strong hands-on experience building and testing scientific or high-precision equipment.
• Experience with photonics, optomechanics, semiconductor devices, cryogenics or precision engineering.
• Familiarity with optical alignment, fiber coupling and/or photonic packaging.
• Experience with mechanical design and CAD tools.
• Good understanding of electronics, instrumentation and test equipment.
• Programming skills in Python, C++, Rust or similar languages for automation and hardware control.
• Experience working with multidisciplinary systems combining optics, mechanics, electronics and software.
• Strong experimental problem-solving skills and the ability to iterate quickly from concept to prototype.
• Excellent written and spoken English, with the ability to produce clear technical documentation and collaborate in an international environment.

Responsibilities

• Design and develop packaging and integration solutions for photonic and quantum devices.
• Integrate single-photon sources, photonic integrated circuits and optical components into complete systems.
• Develop and optimize optical coupling strategies, including fiber coupling and direct chip-to-chip integration.
• Design, build and assemble precision positioning and alignment systems, including nano-positioning stages and multi-axis platforms.
• Develop experimental setups operating under cryogenic conditions, typically in the 2–4 K range.
• Design mechanical parts and assemblies using CAD tools.
• Contribute to electronics development, including PCB design, instrumentation and control systems.
• Automate alignment, test and characterization processes using Python, C++, Rust or similar programming languages.
• Work with microcontrollers, FPGA-based systems or other hardware-control architectures when relevant.
• Build, test and iterate rapidly on prototypes, including using 3D printing and other rapid prototyping techniques.
• Perform test and measurement activities to characterize system performance and identify failure modes.
• Contribute feedback to the design of photonic chips and single-photon sources based on integration and testing results.
• Support the transition from laboratory prototypes to repeatable and scalable manufacturing processes.
• Document designs, experiments, procedures and lessons learned, and actively share knowledge within the team.

Job description

Quandela is seeking a Photonics Packaging & Cryogenic Integration Engineer to advance the integration of single-photon sources, photonic ICs, and optical components into fully integrated systems. You will design packaging solutions, develop cryogenic setups, and contribute to automation of alignment and testing, pushing toward industrial-scale production.

You will combine optics, electronics, mechanics, and software to create robust prototypes, work with CAD tools, and document processes for