Senior MEMS Packaging Engineer - Equity & Bonus Eligible

Sitime-Corporation; Espoo; On-site; EUR 85,000 - 120,000; Full time

Benefits offered by this job

Quarterly bonus

Equity grants

Competitive compensation

Job summary

SiTime is seeking a Sr. Engineer, MEMS Assembly to advance MEMS packaging for next-generation timing products. You will collaborate with MEMS back-end partners to develop and troubleshoot wafer-level packaging technologies while ensuring manufacturability and reliability.

The role emphasizes cross-functional work with MEMS design and characterization teams and aims to define next-generation packaging solutions that improve performance and yield in production environments.

Qualifications

• MS or PhD in Mechanical Engineering, Electrical Engineering, Physics or equivalent with 5+ years industrial experience.
• Experience with MEMS assembly and packaging.
• Solid MEMS base including interactions between design, fabrication and packaging.
• Experience in reliability characterization and yield analysis.
• Experience bringing MEMS products to production is preferred.

Responsibilities

• Manage and work closely with MEMS back-end assembly and packaging partners to develop, evolve, and troubleshoot cutting-edge MEMS wafer-level packaging technologies
• Evaluate impact of assembly processes on device performance and reliability and ensure high yield and quality.
• Work closely with MEMS design and characterization teams to ensure products are designed for manufacturability (DFM) and validated.
• Coordinate and perform failure analysis to characterize and debug assembly process impact on MEMS devices
• Define next generation packaging technologies to enable breakthrough timing products.

Skills

MEMS assembly

MEMS packaging

DFM (design for manufacturability)

Reliability testing

Education

MS in Mechanical Engineering

MS in Electrical Engineering

PhD in Physics

Tools

MEMS fabrication knowledge

Job description

SiTime is seeking a Sr. Engineer, MEMS Assembly to advance MEMS packaging for next-generation timing products. You will collaborate with MEMS back-end partners to develop and troubleshoot wafer-level packaging technologies while ensuring manufacturability and reliability.

The role emphasizes cross-functional work with MEMS design and characterization teams and aims to define next-generation packaging solutions that improve performance and yield in production environments.