Senior MEMS Packaging Engineer (Finland) – Equity & Bonus

SiTime Corp.; Finland; Remote; EUR 70,000 - 110,000; Full time

Benefits offered by this job

Quarterly bonus

Equity grants

Job summary

SiTime Corp. in Finland seeks a Sr. Engineer, MEMS Assembly to drive MEMS packaging technologies for next‑gen timing products. You will lead collaboration with back-end assembly and packaging partners, evaluate processes for yield and reliability, and work with design/characterization teams to ensure manufacturability.

You will define next-generation packaging approaches, troubleshoot issues, and support production readiness in a fast-paced environment while upholding quality and timelines.

Qualifications

• MS or PhD in Mechanical Engineering, Electrical Engineering, Physics or equivalent.
• Experience with MEMS assembly and packaging.
• Solid base in MEMS, including understanding of MEMS design and interactions between design, fabrication, and packaging.
• Experience with reliability characterization and yield analysis.
• Experience in bringing MEMS products to production is preferred.

Responsibilities

• Manage and work closely with MEMS back-end assembly and packaging partners to develop, evolve, and troubleshoot MEMS wafer-level packaging technologies.
• Evaluate impact of assembly processes on device performance and reliability and ensure high yield and quality.
• Work closely with MEMS design and characterization teams to ensure products are designed for manufacturability (DFM) and validated.
• Coordinate and perform failure analysis to characterize and debug assembly process impact on MEMS devices
• Define next generation packaging technologies to enable breakthrough timing products.

Job description

SiTime Corp. in Finland seeks a Sr. Engineer, MEMS Assembly to drive MEMS packaging technologies for next‑gen timing products. You will lead collaboration with back-end assembly and packaging partners, evaluate processes for yield and reliability, and work with design/characterization teams to ensure manufacturability.

You will define next-generation packaging approaches, troubleshoot issues, and support production readiness in a fast-paced environment while upholding quality and timelines.