Camera Module Hardware Engineer

Huawei Finland R&D; Tampere; On-site; EUR 50,000 - 70,000; Full time

Benefits offered by this job

Occupational healthcare

Culture and sports benefits

Team-building events

Daily office breakfasts and snacks

Job summary

A leading mobile technology firm in Tampere is seeking a Camera Module Hardware Engineer. This full-time consultant role will involve designing and testing camera module assemblies for next-generation smartphones. The successful candidate will have a Master's or PhD in electrical engineering and hands-on experience in electronics hardware engineering, PCB design, and soldering. Fluency in English and strong communication skills are essential. Competitive benefits, including occupational healthcare and team-building events, are offered.

Qualifications

• Experience with camera module characterization is a plus.
• Good understanding of signal integrity and EMI considerations is required.
• Exposure to firmware-level device control (I²C, SPI, MIPI CSI-2, or similar) is beneficial.

Responsibilities

• Design and test camera module assemblies for smartphones.
• Capture schematics and own PCB layout and routing.
• Conduct hands-on lab work: soldering, wiring, and measuring.
• Bring up image sensors and power management circuits.
• Write evaluation reports for engineering and executives.

Skills

Hands-on experience in electronics hardware engineering

Solid grounding in PCB design

Comfortable with soldering and measurements

Experience bringing up mixed-signal systems

Fluent in English

Strong written communication skills

Education

MSc or PhD degree in electrical engineering or relevant fields

Job description

Huawei Finland Handset Camera Innovation Lab is looking for a Camera Module Hardware Engineer to join us. We're a fast-moving team passionate about pushing the boundaries of what a smartphone camera can do. You'll be an integral member of our Camera Module Hardware team, working hands‑on across the full development cycle — from early schematic capture through bring‑up, characterization, and evaluation reporting — and we’re looking for an engineer passionate about delivering novel, high‑quality hardware for millions of users.

This position is based in Tampere and will sit with our Handset Camera Innovation Team, which has a solid track record in both innovation and publication.

Job Descriptions

• Designing, prototyping, and testing camera module assemblies for next‑generation smartphones
• Capturing schematics and owning PCB layout and routing for evaluation boards and prototypes
• Getting hands‑on in the lab: soldering, wiring, probing, and measuring — you’ll know your way around a bench
• Bringing up image sensors, actuators, and power management circuits from scratch
• Configuring image sensors and actuators at the firmware level, including still image and video streaming pipelines
• Running a full suite of electrical measurements — analog and digital — to validate designs and chase down root causes
• Performing simulations across electrical, electromagnetic, EMI, and signal integrity domains
• Translating findings into clear, rigorous evaluation reports for engineering peers and executive stakeholders

Qualifications and detailed requirements

• MSc or PhD degree in electrical engineering or other relevant fields
• Hands‑on experience in electronics hardware engineering, ideally in consumer electronics or mobile
• Solid grounding in PCB design — schematic capture, layout, and routing — with a practical understanding of signal integrity and EMI considerations
• Comfortable at the bench: you solder, probe, and measure without hesitation
• Experience bringing up mixed‑signal systems, including image sensors, VCMs, or power management ICs
• Some exposure to firmware‑level device control (I²C, SPI, MIPI CSI‑2, or similar)
• Strong written communication — you can write a teardown report that’s effective both at engineering and executive levels
• Fluent in English, both written and spoken
• Big advantage for contestants from international competitions in computer science, mathematics, or physics (e.g., IOI, IMO, ICPC, IPhO, IChO)

Nice to Have Skills

• Hands‑on experience with camera module characterization (MTF, noise, OIS performance, etc.)
• Familiarity with MIPI standards or ISP tuning workflows
• Able to run simulations and interpret results across electrical and EM domains
• Experience in a fast‑paced, high‑ownership engineering environment

Contract Type

This is a full‑time consultant position; the consultant shall be employed by Huawei’s supplier.

We offer competitive benefits including occupational healthcare, culture and sports benefits, team‑building events and celebrations, employee recognition through awards and gifts, and daily office breakfasts and snacks.