Package Design Engineer – Imaging & Microelectronics

Teledyne Technologies Incorporated; Sevilla; Presencial; EUR 45.000 - 65.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Teleworking option

Onboarding program

Career development paths

Alpine living environment

Descripción de la vacante

Teledyne e2v Semiconductors SAS, located in Seville, seeks a Package Design Engineer to lead the full design flow of advanced microelectronic packages and translate customer needs into technical specifications.

You will work closely with packaging vendors and assembly houses, conduct simulations, and guide design reviews to shape next‑generation imaging packages for high‑reliability applications.

Formación

• Bachelor’s degree in microelectronics or electronics required.
• First confirmed experience in packaging design.
• Specific imaging/assembly experience is a plus.
• Mastering of package design flow from specification to validation.

Responsabilidades

• Lead the complete design flow of organic and ceramic multi‑layer packages (BGA, PGA, CLCC, CQFP, WLCSP).
• Interface with packaging vendors and assembly houses throughout the project lifecycle.
• Conduct electrical, thermal and mechanical simulations as needed and perform DRC checks.
• Guide technical reviews and identify new vendors; monitor future packaging technologies.

Conocimientos

Microelectronics

Packaging design

Imaging sensors

Project coordination

Electronics design

Educación

Bachelor’s degree in Microelectronics or Electronics

Herramientas

Cadence APD

SolidWorks

Ansys

Cadence Xtract IM

Descripción del empleo

Teledyne e2v Semiconductors SAS, located in Seville, seeks a Package Design Engineer to lead the full design flow of advanced microelectronic packages and translate customer needs into technical specifications.

You will work closely with packaging vendors and assembly houses, conduct simulations, and guide design reviews to shape next‑generation imaging packages for high‑reliability applications.