Job offer

European Commission; España; Presencial; EUR 40.000 - 65.000; Jornada completa

Descripción de la vacante

A leading company is seeking a Photonic and Advanced Packaging Design Engineer to develop cutting-edge photonic packaging solutions. The role involves design, simulation, and validation of advanced modules, requiring strong expertise in photonics and mechanical engineering. Candidates should possess a relevant degree and have over 3 years of industry experience, preferably in aerospace or telecommunications.

Formación

• 3+ years of experience in photonic packaging design, preferably in aerospace, defense, or telecom.
• Experience with fiber alignment, die attach, wire bonding, and hermetic sealing.
• Familiarity with space-grade reliability requirements.

Responsabilidades

• Design and develop photonic packaging solutions for integrated photonic devices.
• Collaborate with engineers to define packaging architectures.
• Perform simulations to validate design robustness.

Conocimientos

Photonics

Mechanical Engineering

Electronics

Problem-solving

Analytical skills

Educación

Bachelor’s degree in Photonics, Physics, Electronics, or Mechanical Engineering

Master’s degree or PhD

Herramientas

SolidWorks

ANSYS

COMSOL

AutoCAD

Descripción del empleo

Technology » Telecommunications technology

Organisation/Company ALTER TECHNOLOGY TÜV NORD S.A.U. Department HiRel Semiconductors Research Field Technology » Optronics Technology » Telecommunications technology Researcher Profile Recognised Researcher (R2) Positions Other Positions Country Spain Application Deadline 30 Jun 2025 - 14:16 (Europe/Madrid) Type of Contract Permanent Job Status Full-time Hours Per Week 40 Offer Starting Date 1 Sep 2025 Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No

Offer Description

We are seeking a highly motivated and detail-oriented Photonic and Advanced Packaging Design Engineer to join our multidisciplinary team focused on the development of photonic and advanced packaged modules. The successful candidate will be responsible for the design, simulation, and validation of advanced photonic packaging solutions, ensuring performance, robustness, and compliance with required standards.

Key Responsibilities

• Design and develop photonic packaging solutions for integrated photonic devices, including fiber-optic coupling, thermal management, and mechanical stability.
• Collaborate with optical, mechanical, and electronic engineers to define packaging architectures and interfaces.
• Perform simulations (thermal, mechanical, optical) to validate design robustness under harsh environmental conditions.
• Support prototyping, assembly, and testing of photonic modules, including alignment and bonding processes.
• Contribute to the development of custom package designs and CAD libraries for photonic components.
• Interface with suppliers and manufacturing partners to ensure design-for-manufacturability and quality assurance.
• Document design processes, test results, and qualification procedures in accordance with internal and ESA/NASA standards.

Where to apply

E-mail [e-mail]

Requirements

Research Field Technology Education Level Master Degree or equivalent

Research Field Technology Education Level PhD or equivalent

Research Field Technology Education Level Bachelor Degree or equivalent

Skills/Qualifications

• Bachelor’s or Master’s degree in Photonics, Physics, Electronics, Mechanical Engineering, or a related field.
• 3+ years of experience in photonic packaging design, preferably in aerospace, defense, or telecom sectors.
• Proficiency in CAD tools (e.g., SolidWorks, Zemax, L-Edit, AutoCAD) and simulation software (e.g., COMSOL, ANSYS).
• Hands-on experience with fiber alignment, die attach, wire bonding, and hermetic sealing techniques.
• Familiarity with space-grade reliability requirements and environmental testing (thermal cycling, vibration, radiation).
• Strong analytical and problem-solving skills, with a proactive and collaborative mindset.
• Fluent in English (written and spoken); Spanish is a plus.

Specific Requirements

• Experience with heterogeneous integration and co-packaging of photonic and electronic components.
• Knowledge of standards such as MIL-STD, ECSS, or JEDEC for high-reliability packaging.
• Background in optoelectronic module development for secure communications or sensing applications.