System Architect – Power Modules & Intelligent Power Modules (IPM) | Power Business Unit

L&T Semiconductor Technologies; München; Vor Ort; EUR 100.000 - 130.000; Vollzeit

Zusammenfassung

L&T Semiconductor Technologies in München is seeking a highly experienced System Architect to drive the technical definition of next-generation Power Modules. This role focuses on system engineering, product definition, and technical leadership in semiconductor development.

The ideal candidate has over 12 years of experience in power semiconductors and will be responsible for defining requirements, conducting trade-offs, and leading technical reviews within the R&D team.

Qualifikationen

• 12+ years of experience in power semiconductors, power modules, or power electronics systems.
• Deep expertise in semiconductor packaging and thermal management.
• Experience with mission profile analysis and reliability assessments.

Aufgaben

• Define system architectures for SiC/IGBT Power Modules.
• Own Product Requirement Specifications and Build-to-Print documentation.
• Perform architecture trade-offs and system feasibility studies.

Kenntnisse

SiC and IGBT devices and modules

Power converter topologies and system design

Electro-thermal modelling and simulations

Reliability engineering

Industrial power systems

Ausbildung

Master's or PhD in Electrical Engineering

Tools

MATLAB/Simulink

Ansys Icepak

Jobbeschreibung

L&T Semiconductor is building a next-generation portfolio of SiC and IGBT-based Power Modules and Intelligent Power Modules (IPMs) for Industrial, Energy, Automotive, HVAC, and Data Center applications.

We are looking for a highly experienced System Architect to lead the technical definition and architecture of these products. This is a highly technical role focused on system engineering, product definition, and Build-to-Print handoff to R&D teams.

Key Responsibilities

• Define system architectures for SiC/IGBT Power Modules and IPMs from concept to product definition.
• Own Product Requirement Specifications (PRS), System Requirement Specifications (SRS), and complete Build-to-Print documentation.
• Define electrical, thermal, mechanical, reliability, and functional requirements, including:
  • Voltage and current ratings
  • Efficiency and power density targets
  • Thermal performance and cooling concepts
  • Protection, sensing, and monitoring functions
  • Isolation and gate driver interfaces
  • Reliability and lifetime requirements
• Perform architecture trade-offs and system feasibility studies, including:
  • Electro-thermal modelling and simulations
  • Mission profile and lifetime analysis
  • Design margin and derating methodologies
  • Design-for-Cost, Design-for-Manufacturing, and Design-for-Reliability assessments
• Develop technology roadmaps for:
  • SiC Power Modules (1.2 kV to 6.5 kV)
  • High-frequency and high-power-density power conversion platforms
  • Advanced packaging and cooling technologies
• Serve as the technical interface between customers, Product Management, and R&D organizations.
• Lead architecture reviews, technical risk assessments, validation strategy, and support root-cause analysis during development and customer evaluations.

Desired Experience

12+ years of experience in power semiconductors, power modules, or power electronics systems.

• Deep expertise in:
  • SiC and IGBT devices and modules
  • Power converter topologies and system design
  • Electro-thermal modelling and simulations
  • Semiconductor packaging and thermal management
  • Reliability engineering and mission profile analysis
  • Industrial, Energy, Automotive, HVAC, or Data Center power systems
• Experience with tools such as PLECS, LTspice, MATLAB/Simulink, Simplis, Ansys Icepak, or equivalent.