Senior Field Application Engineer (FAE) - MPU & DNPU (f/m/d)

NXP Semiconductors

München

Vor Ort

EUR 90.000 - 120.000

Vollzeit

14 Tage+

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Zusammenfassung

NXP Semiconductors in Germany is seeking a Senior Field Application Engineer to support robotic edge compute solutions across EMEA. You will work with Sales and KA managers as the technical interface to customer engineering, guiding system architects from silicon selection to software stack integration on NXP MPU and DNPU processors for robotics.

The role requires a Master’s in EE/CE/CS, 10+ years in embedded Linux, strong scripting, and hands‑on experience with ARM Cortex‑A and high‑speed

Qualifikationen

  • Master’s degree in Electrical Engineering, Computer Engineering or Computer Science.
  • 10+ years in embedded systems development or applications support of MPU/SoC-based platforms with embedded Linux.
  • Strong embedded Linux experience across bootloader, kernel, drivers, device tree, Yocto/build system, and user-space.
  • Working knowledge of Python or scripting for tooling and automation.
  • Hands-on experience with ARM Cortex-A class application processors and heterogeneous compute architectures.
  • Knowledge of high-speed interfaces (LPDDR, PCIe, USB 3.x, MIPI-CSI/DSI, Ethernet, SDIO/eMMC, QSPI).
  • Excellent verbal and written communication; travel willingness; fluent English.

Aufgaben

  • Provide technical leadership to sales teams and customers covering edge‑compute architecture, processor selection, bring‑up, and software stack integration for NXP MPU and DNPU processors targeting robotics platforms.
  • Partner with customers on the design of companion computers, central compute, vision/perception subsystems, and HMI nodes — from silicon selection through Linux board bring‑up, kernel/driver enablement, and system performance tuning.
  • Design support and lab troubleshooting through schematic reviews, bench bring‑up, debugging, and root‑cause analysis across hardware, kernel, drivers, and middleware.
  • Enable customer AI, vision, and sensor‑fusion workloads on NXP processors and integrated NPUs, helping customers move models from training frameworks to optimized on‑device inference for perception, navigation, and HMI use cases.

Kenntnisse

Embedded Linux
Python
ARM Cortex-A
Communication
Willingness to travel
English fluency
Lab troubleshooting

Ausbildung

Master’s degree in Electrical Engineering, Computer Engineering or Computer Science

Tools

Yocto
U-Boot
Kernel debugging

Jobbeschreibung

AI is rapidly moving beyond research labs and into the real world—powering advancements in vehicles, factories, hospitals, homes, drones and everyday devices. NXP’s Global Sales organization is the force that transforms our intelligent edge vision into meaningful market impact. We operate on the front lines of innovation, delivering real‑world AI, secure edge intelligence, and breakthrough technologies to the customers shaping tomorrow’s world.

As a strategic partner at the intersection of customer ambition and NXP capability, our global sales team drives alignment, opens new markets, and builds the relationships that lead to design wins and revenue growth.

As part of the evolution of the European Microprocessors (MPUs) and Discrete Neural Processors Units (DNPUs) Field Application Engineering organization, we are looking for a senior FAE to support our solutions for key customers in EMEA with a focus on the robotics segment and more specifically drones.

In this role, working closely with Sales and Key Account Managers, you will act as the primary technical interface to customer engineering teams, supporting system architects and developers in defining and deploying next‑generation systems.

Responsibilities
  • Provide technical leadership to sales teams and customers covering edge‑compute architecture, processor selection, bring‑up, and software stack integration for NXP MPU and DNPU processors targeting robotics platforms.
  • Partner with customers on the design of companion computers, central compute, vision/perception subsystems, and HMI nodes — from silicon selection through Linux board bring‑up, kernel/driver enablement, and system performance tuning.
  • Design support and lab troubleshooting through schematic reviews, bench bring‑up, debugging, and root‑cause analysis across hardware, kernel, drivers, and middleware.
  • Enable customer AI, vision, and sensor‑fusion workloads on NXP processors and integrated NPUs, helping customers move models from training frameworks to optimized on‑device inference for perception, navigation, and HMI use cases.
Job Qualifications
  • Master’s degree in Electrical Engineering, Computer Engineering or Computer Science
  • 10+ years in embedded systems development or applications support of MPU / SoC‑based platforms running embedded Linux, with demonstrated technical leadership.
  • Strong embedded Linux experience across the full stack: bootloader (u‑boot), kernel and device drivers, device tree, Yocto / build system, and user‑space integration.
  • Working knowledge of Python or scripting for tooling and automation.
  • Hands‑on experience with ARM Cortex‑A class application processors and heterogeneous compute architectures pairing application cores with real‑time microcontroller cores.
  • Working knowledge of high‑speed application‑processor interfaces and how to design around them: LPDDR, PCIe, USB 3.x, MIPI‑CSI / MIPI‑DSI, Gigabit / Multi‑Gigabit Ethernet, SDIO / eMMC, and QSPI.
  • Excellent verbal and written communication for both technical and non‑technical stakeholders.
  • Willingness to travel
  • Fluent English required
Specialty And Bonus Skills
  • Hands‑on experience enabling AI / ML workloads on edge processors and integrated NPUs, including model conversion and optimization from common training frameworks to on‑device inference for robotics perception.
  • Familiarity with robotics middleware and stacks: Rust, ROS / ROS 2, DDS, real‑time Linux (PREEMPT_RT), and common SLAM, navigation, and motion‑planning frameworks.
  • Working knowledge of platform security: TrustZone, secure boot, OP‑TEE, integrated secure enclaves, and secure‑element integration for authenticated robotics endpoints.
  • Familiarity with power‑management subsystems for application processors (PMIC integration, DVFS, multi‑rail / thermal management) and battery‑powered system architectures.
  • Working knowledge of functional safety (ISO 26262, IEC 61508 / SIL 2–3) and cybersecurity (ISO 21434, IEC 62443) standards relevant to industrial and automotive edge‑compute systems.
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