Senior Equipment Engineer – Wafer Lamination & Mounting (f/m/d)

Black Semiconductor GmbH; Aachen; Vor Ort; EUR 90.000 - 130.000; Vollzeit

Benefits dieser Stelle

Health insurance

Pension plan

Stock options

Zusammenfassung

Black Semiconductor GmbH is seeking a Senior Equipment Engineer for Wafer Lamination & Mounting to lead the installation, maintenance, and optimization of wafer tapping and mounting equipment. You will ensure equipment health and maximize product quality in a fast-paced cleanroom environment.

The role bridges mechanical troubleshooting, equipment engineering, and process optimization, requiring hands-on experience with lamination processes and strong collaboration with Process Engineering.

Qualifikationen

• Bachelor’s degree or equivalent in a technical field.
• 5+ years semiconductor equipment engineering experience in Back-End Assembly/Advanced Packaging.
• Hands-on maintenance of wafer tape-frame equipment.
• Experience in ISO 5/6 cleanroom environments.
• Ability to lift up to 15 kg and perform physical maintenance tasks.

Aufgaben

• Own performance, reliability, and lifecycle management of wafer taping and mounting equipment.
• Lead escalation-level troubleshooting across electromechanical, pneumatic, robotic, motion-control, vacuum, and automation systems.
• Drive root-cause analysis and permanent corrective actions for lamination defects and yield loss.
• Collaborate with Process Engineering to optimize equipment configurations for taping, lamination, backgrinding, dicing, and thin-wafer handling.
• Improve equipment performance through data-driven reliability engineering and predictive maintenance.
• Lead continuous improvement initiatives including hardware modifications and software upgrades.
• Manage OEM/vendor interactions, spare parts strategy, and training of technicians.

Kenntnisse

Pneumatics

Servo systems

Robotics

Wafer handling

Motion control

Ausbildung

Bachelor's degree in Mechanical Engineering, Electrical Engineering, or Mechatronics

Tools

Takatori

Disco

Adwill-Lintec

Tazmo

Nitto-Denko

Jobbeschreibung

About us

We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects

About our technology

The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude

In short,

we connect chips to create powerful and energy‑efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution

The Role

We are seeking a skilled Senior Equipment Engineer - Wafer Lamination & Mounting at Black Semiconductor to lead the installation, maintenance, and optimization of wafer taping and mounting equipment. You will own the health and performance of fully automated lamination modules, maximizing product quality through equipment reliability and process stability. Working in a fast‑paced cleanroom environment, you will optimize tape application parameters, eliminate lamination‑related failure modes, and help introduce Black Semiconductor's novel technology to high‑volume manufacturing.

This role bridges mechanical troubleshooting, equipment engineering, and process optimization.

To join our team, you should be excited to

• Own the performance, reliability, and lifecycle management of wafer taping and mounting equipment at Black Semiconductor, including installation, commissioning, qualification, and preventive maintenance strategy.
• Lead escalation‑level troubleshooting across electromechanical, pneumatic, robotic, motion‑control, vacuum, and automation systems in a cleanroom manufacturing environment.
• Drive root‑cause analysis and permanent corrective actions for equipment failures, lamination defects (e.g., bubbles, voids, tension issues), yield loss, and scrap events.
• Partner with Process Engineering to optimize equipment configurations for taping, lamination, backgrinding, dicing, and thin‑wafer handling applications.
• Improve equipment performance through data‑driven reliability engineering (MTBF/MTTR), FDC analysis, and predictive maintenance strategies.
• Lead continuous improvement initiatives including hardware modifications, software upgrades, and cost‑of‑ownership reduction to improve yield, throughput, safety, and maintainability.
• Manage OEM/vendor interactions, international tool acceptance, spare parts strategy, and technical documentation (SOPs, PM procedures), while training and certifying technicians.

Your Qualifications

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Mechatronics, or related technical field, or equivalent experience.
• 5+ years of semiconductor equipment engineering experience within Back‑End Assembly, Advanced Packaging, Wafer Thinning, or related manufacturing areas.
• Hands‑on experience maintaining and troubleshooting wafer tape‑frame equipment (e.g.: Takatori, Disco, Adwill‑Lintec, Tazmo, Nitto‑Denko, or similar).
• Strong knowledge of pneumatics, servo systems, robotics, wafer handling, motion control, sensors, vacuum systems, and industrial automation.
• Experience working in ISO 5/6 (Class 100/1000) cleanroom environments.
• Experience with temporary bond/debond, wafer backgrind, UV irradiation, or related backend processes will be considered a plus
• Ability to work safely and effectively in a cleanroom environment while wearing full cleanroom (bunny suit) attire for extended periods; ability to perform the physical requirements of the role, including lifting up to 15 kg (35 lbs) and carrying out maintenance tasks involving bending, kneeling, and reaching around equipment.

Our work culture

People Over Processes.

At Black Semiconductor, flexibility is key—we ensure work adapts to life, not the other way around. We champion work‑life harmony, where careers are meaningful and enriching. Our processes are human‑centric, allowing you to focus on what matters

Let’s grow together.

Your potential is our priority. We provide the autonomy to make a lasting impact and nurture your growth through a culture of continuous learning. We invest in your journey for professional and personal development

Your Health and Future Matter.

Your well-being is paramount. We offer a comprehensive benefits package with outstanding insurance, pension and virtual stock options for your mental, physical, and financial health. Your peace of mind is our priority - in the present and future

We Live Openness.

Collaboration and inclusivity are the cornerstones of our culture. We practice openness, fostering trust and respect. Individuality is our collective strength, fueling innovation and driving us forward

We connect chips - and people.

We encourage qualified individuals from any background to apply. We foster an inclusive and supportive work environment that values collaboration, innovation, and growth. Join our team and be part of an organization dedicated to making a difference in the industry

If your application results in an employment relationship, your Applicant Data will be transferred to our personnel records and processed in accordance with applicable legal requirements; otherwise, your Applicant Data will be retained for up to six (6) months after completion of the recruitment process. Read more about our privacy policy here.

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