QPU Integration Engineer (Micro-Fabrication focused) (f/m/d)

Entangled Future; Hamburg; Hybrid; EUR 90,000 - 140,000; Full time

Benefits offered by this job

Flexible working hours

Wellness package

Bike leasing

Moving benefits

Team events

Modern workplace

Job summary

eleQtron is seeking a Senior QPU Integration Engineer (Micro-Fabrication focused) in Hamburg to lead FEOL/BEOL integration, drive yield optimization, and manage technology transfers with external foundries. You will bridge chip design and fabrication teams, owning both front-end and back-end modules in a high-tech cleanroom environment.

You will collaborate with QPU designers, device physics, and packaging teams to translate architectural needs into manufacturable DRCs and PDks, while guiding

Qualifications

• Master's or Ph.D. in Microelectronics, Electrical Engineering, Materials Science, Applied Physics, Nanotechnology, or a related field.
• 2+ years hands-on semiconductor or quantum hardware integration in a cleanroom.
• Strong FEOL/BEOL module development experience.
• Experience coordinating with external foundries/partners for tech transfers.
• Fluent in English (written and spoken).

Responsibilities

• Serve as SME for FEOL/BEOL fabrication modules and drive end-to-end integration flows.
• Collaborate with QPU designers, device physics, and packaging teams to define manufacturable DRCs and PDKs.
• Lead daily cleanroom activities, set process baselines, and manage deviations.
• Feed metrology and yield data back into design/layout iterations.
• Manage technology transfer projects with external foundries and research institutes.
• Oversee RCA, PFMEA, and SPC to improve process robustness.

Skills

FEOL/BEOL integration

Project management

RCA & PFMEA

Technical writing & presentation

English fluency

Education

Master's or PhD in Microelectronics / EE / Materials Science / Applied Physics / Nanotechnology

Tools

KLayout

Cadence

Python

MATLAB

Job description

QPU Integration Engineer (Micro-Fabrication focused) (f/m/d) at eleQtron, Hamburg, Hamburg, Germany. A mid-level full time position in the Chip design & Packaging team, listed under hardware engineering.

We are looking for a Senior QPU Integration Engineer (Micro-fabrication focused). You will be a lead technical expert in our QPU Development team, driving the physical integration, yield optimization, and technology transfer of next-generation quantum processor architectures. In this pivotal role, you will serve as the primary bridge between chip design teams and fabrication engineers. You will own both front-end-of-line (FEOL) and back-end-of-line (BEOL) fabrication modules, leading R&D activities within our internal cleanroom facility while managing strategic development projects with external foundry partners.

What you can expect from eleQtron

• Competitive salary: We value our team members and therefore provide remunerations that reflect this, additionally rewarding achievements.
• Flexible working hours : We offer personal freedom through a variety of flexible work schedules
• Team spirit: In our international and diverse team, and with our regular team events, having fun at work is simply part of the culture
• Further development: We want to grow together and so we offer our team members needs-based, individualized further training as well as plenty of room for personal development
• Wellness Package : We offer health-promoting benefits such as fitness programs like UrbanSportsClub to support your well-being
• Bike Leasing: Stay Mobile and Sustainable with Our Company Bike Leasing Program
• Moving Benefits: A warm welcome! We are happy to support employees who move for us with a bonus
• At the forefront : Work at the forefront of technology, where academic research meets commercial applications
• Modern workplace: We have a high-quality infrastructure with laboratory space, offices and meeting rooms

Responsibilities

• Serve as the Subject Matter Expert (SME) for critical FEOL/BEOL fabrication modules (e.g., advanced lithography, thin-film deposition, metal/dielectric stack etch, dielectric isolation, surface passivation, and interconnects).
• Lead end-to-end integration flows, evaluating and optimizing process interactions across multi-layer QPU stack architectures.
• Collaborate closely with QPU designers, device physics teams, and packaging specialists to translate architectural requirements into manufacturable Design Rules (DRC) and process design kits (PDKs).
• Feed cleanroom metrology, yield data, and failure analysis insights directly back into design and layout iterations.
• Take the lead in managing daily internal cleanroom fabrication activities, schedule runs, set process baselines, and resolve real-time process deviations.
• Oversee internal R&D projects to develop, qualify, and integrate novel materials, geometries, and process steps for next-gen QPU platforms.
• Drive technology development and project management with external commercial foundry partners and research institutes.
• Lead process transfer, yield matching, and contract negotiation for out-of-house fabrication and prototyping runs.
• Lead Root Cause Analysis (RCA) and Process Failure Mode and Effects Analysis (PFMEA) for critical integration failures, lot losses, or performance degradation.
• Define and maintain Statistical Process Control (SPC) guidelines, process windows, and target specifications across internal and external fabrication runs.

Requirements

• Master’s or Ph.D. in Microelectronics, Electrical Engineering, Materials Science, Applied Physics, Nanotechnology, or a related field.
• 5+ years (or equivalent extensive industry experience) of hands-on semiconductor or quantum hardware integration experience in a professional cleanroom environment (Class 10 / 100 / ISO 4–5).
• Deep technical expertise in both Front-End (FEOL) and Back-End (BEOL) module development (e.g., e-beam/optical lithography, PVD/ALD thin films, reactive ion etching (RIE/DRIE), planarization, lift-off processes, and flip-chip/interconnect technologies).
• Proven track record of taking complex solid-state micro/nano devices from initial R&D concept to stable, repeatable integration flows.
• Demonstrated experience in managing joint development projects (JDPs) or technology transfers with commercial external foundries or external fabrication partners.
• Strong project management capabilities, including timeline tracking, deliverable management, and milestone execution.
• Solid understanding of Statistical Process Control (SPC), Design of Experiments (DOE), PFMEA, and structured RCA techniques (e.g., 8D, Fishbone).
• Proficiency with layout and data tools (e.g., KLayout, Cadence, Python/MATLAB for yield and parametric analysis).
• Fluent in English (written and spoken) with excellent technical writing and presentation skills.

Nice to Have

• Experience in quantum hardware integration (e.g., superconducting circuits, trapped-ion traps, spin qubits, or photonic chips).
• Experience developing novel low-loss dielectric materials, superconducting interconnects, or 3D integration / TSV technologies.
• Proven experience establishing a cleanroom process baseline or setting up new-process lines/tools from scratch.
• Background in managing foundry contracts, IP considerations, and wafer delivery schedules.