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Barkhausen Institut in Dresden invites applications for a Research Associate “Layout Engineer” (m/f/d) to advance digital IC layout on advanced processes. The position is initially for 2 years and paid according to TV-L E-13, with potential for qualification such as a PhD.
Responsibilities include layout design and floorplanning of digital ICs, DRC/LVS/ERC verification, timing analysis and power optimization, and supporting RTL-to-GDSII flows for 12nm FDSOI and open-source PDKs (IHP 130nm).
The Barkhausen Institut performs research on the latest hardware, software and communication technologies and demonstrates their application in tomorrow’s society. Our goal is to build a flexible and trustworthy IoT platform based on reliable electronics and secure communication methods.
At the earliest possible date we are looking for a
The position will initially be filled for a period of 2 years and will be remunerated in line with TV-L E-13. The position aims at supporting further academic qualification (e.g. PhD).
This position is ideal for gaining serious exposure to IC development cycles and it can be a key enabler for ambitions to work in Custom/Digital IC industry. If you have passion for new technologies and the desire to develop the connected world of tomorrow with us, we are looking for you.
Life and science are compatible at our institute. We offer a range of recognised family-friendly measures, such as part-time work, mobile working and flexible working hours that take family needs into account. We also offer support for arriving in Dresden (all formalities, apartment etc.).
Barkhausen Institut strives for gender and diversity equality. We welcome applications from all backgrounds. Severely disabled persons are given preference in the event of equal suitability.
Applications from women are particularly welcome.
The data submitted by you in the course of the application procedure will be processed by the Barkhausen Institut (BI). BI shall use the data for the purposes of the application procedure. No data shall be passed on to third parties.