Get a reply from this employer
Your resume and cover letter, tailored to exactly what they’re hiring for.
Fraunhofer ENAS invites Bachelor's/Master's students to conduct a comparative study of copper sintering pastes and preforms for inductive die-attach applications. You will perform a literature review, prepare pastes and preforms, assemble die-attach test pieces, run inductive sintering experiments, and characterize joints.
The ideal candidate is enrolled in a relevant program, based in the Chemnitz area, with interest in experimental lab work, basic materials characterization, and strong German
The Fraunhofer-Gesellschaft ( www.fraunhofer.com ) is one of the world's leading organizations for application-oriented research. 74institutes develop pioneering technologies for our economy and society – more precisely: 30000 people from technology, science, administration and IT. They know: Anyone who comes to Fraunhofer wants to and can make a difference. For themselves, for us and for the markets of today and tomorrow.
The department System Packaging focuses on innovative packaging technologies for microelectronics and power electronics. The main emphasis lies on the development of reliable interconnection and bonding techniques that meet increasing demands in thermal and mechanical stability. In the context of electromobility and other high- tech applications, we investigate new approaches for using copper as a cost-efficient and high-performance material in packaging solutions.
The increasing demand for compact and reliable power electronic systems drives the development of advanced die-attach technologies. Inductive sintering is a promising alternative to conventional soldering and offers fast, localized heating with reduced thermal exposure of surrounding components. Copper is particularly attractive as a sintering material due to its excellent electrical and thermal properties.
In this Bachelor’s/Master’s thesis, copper sintering pastes and preforms will be investigated and compared for inductive die-attach applications. The study will focus on process performance, heating behaviour, bond-line consistency, joint quality, and porosity to evaluate the advantages and limitations of both material forms.
We are looking for a motivated student to experimentally investigate and compare copper pastes and preforms for inductive sintering and contribute to the development of an efficient and reliable die-attach process.
We value and promote the diversity of our employees' skills and therefore welcome all applications – regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability. Our tasks are diverse and adaptable – for applicants with disabilities, we work together to find solutions that best promote their abilities.
With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.
Fraunhofer Institute for Electronic Nano Systems ENAS
Requisition Number: 85880 Application Deadline: