Radar Mechanical Engineer - RF Packaging & Radomes

Destinusgroup; Zürich; Vor Ort; CHF 90.000 - 140.000; Vollzeit

Benefits dieser Stelle

Stock options

Gym access

Breakfast at company expense

Zusammenfassung

Destinusgroup is seeking a mechanical engineer to design enclosure and radome structures for radar and RF systems. You will select materials for lightweight, durable, RF-transparent assemblies and perform structural analysis for vibration and wind loads.

Responsibilities include sealing, mounting, thermal management, and prototyping to ensure manufacturability and quality in harsh environments; collaboration with electronics for PCB co-design and testing is expected.

Qualifikationen

• Proficiency in mechanical design and RF-friendly packaging.
• Knowledge of materials properties for metals, composites, polymers.
• Experience with environmental sealing and IP ratings is a plus.
• Familiarity with MIL-STD-810 or similar environmental tests.
• Proficiency with 3D-printing technologies.
• Experience in radar/RF systems packaging.

Aufgaben

• Design enclosure and radome structures that are lightweight, durable and RF-transparent.
• Select materials based on strength, weight and corrosion resistance; perform structural analysis for vibration and wind loads.
• Ensure sealing, gasketing and coatings meet IP ratings; design for wide temperature ranges and harsh conditions.
• Develop mounting and integration solutions for vehicles, towers, UAVs and installations; ensure precise alignment and stability of radar.
• Contribute to thermal management with passive/active cooling, thermal simulations and testing; support thermomechanical PCB co-design.
• Involve prototyping and manufacturing support to ensure manufacturability and quality.

Kenntnisse

Mechanical design

RF packaging

Thermal analysis

Materials knowledge

Precision tolerance

Radar/RF systems

Tools

Siemens NX

Teamcenter (TC)

Jobbeschreibung

Destinusgroup is seeking a mechanical engineer to design enclosure and radome structures for radar and RF systems. You will select materials for lightweight, durable, RF-transparent assemblies and perform structural analysis for vibration and wind loads.

Responsibilities include sealing, mounting, thermal management, and prototyping to ensure manufacturability and quality in harsh environments; collaboration with electronics for PCB co-design and testing is expected.