Substrate IC Package Layout Design Engineer

Etched.ai, Inc.; San Jose (CA); Vor Ort; USD 120’000 - 180’000; Vollzeit

Zusammenfassung

An innovative firm is seeking a Substrate IC Package Layout Design Engineer to lead the design of complex IC substrate packages for high-performance AI processors. This role demands expertise in high-speed signaling and power delivery networks, with a focus on optimizing designs for performance. Join a fully in-person team that values engineering excellence and offers a collaborative environment where your contributions will directly impact cutting-edge AI hardware. If you have a passion for pushing the boundaries of what's possible in chip design, this opportunity is perfect for you.

Leistungen

Full medical, dental, and vision packages

Housing subsidy of $2,000/month

Daily lunch and dinner

Relocation support

Qualifikationen

• 10+ years of experience in IC substrate layout design for high-performance processors.
• Extensive experience with complex high-density layouts and power delivery networks.

Aufgaben

• Lead the design of complex IC substrate layouts for high-power AI processors.
• Develop high-speed signal routing solutions while minimizing integrity issues.

Kenntnisse

IC substrate layout design

High-speed signaling design

Signal integrity mitigation

Power delivery network design

CoWoS interposer design

Analytical skills

Ausbildung

Bachelor’s degree in Electrical Engineering

Master’s degree in Electrical Engineering

Tools

Allegro Package Designer

Jobbeschreibung

Substrate IC Package Layout Design Engineer

About Etched

Etched is building AI chips that are hard-coded for individual model architectures. Our first product (Sohu) only supports transformers, but has an order of magnitude more throughput and lower latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents.

Role Summary

As a Substrate IC Package Layout Design Engineer, you will be responsible for the end-to-end design of complex IC substrate packages, supporting high-power consumption and high-speed signaling. The ideal candidate will have extensive experience with large substrate designs (>50mm), complex power delivery networks, and high-speed signaling solutions (up to and beyond 50GHz). You will work closely with silicon, signal integrity, power integrity, and system help co-design world class substates with OSAT providers. Intense focus on optimization for power delivery through substrate, pushing what’s possible.

Key responsibilities

• IC Substrate Layout Design

  • Lead the design and development of complex IC substrate layouts for high-power AI processors and accelerators.

  • Design large (>50mm) and complex multi-layer substrate packages with high pin counts and dense routing requirements.

  • Ensure robust power delivery designs capable of supporting >700W custom silicon solutions.

• High-Speed Signal Routing & Integrity

  • Develop high-speed signal routing solutions capable of supporting >50GHz signaling while minimizing signal integrity issues such as loss and crosstalk.

  • Collaborate with SI/PI engineers to define signal integrity and power integrity requirements and implement solutions in substrate layout.

• Advanced Packaging & CoWoS Integration

  • Optimize CoWoS (Chip-on-Wafer-on-Substrate) interposer designs for thermal and electrical performance.

  • Work closely with chip design, packaging, and manufacturing teams to ensure design feasibility and manufacturability.

• Design Validation & Verification

  • Perform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for all substrate designs.

  • Develop and maintain design documentation and guidelines for future substrate designs.

  • Support design reviews and provide technical guidance to junior team members.

You may be a good fit if you have

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.

• 10+ years of experience in IC substrate layout design for high-performance processors or accelerators.

• Extensive experience with large substrate packages (>50mm) and complex high-density layouts.

• Proven experience with high-power (700W+) package designs and robust power delivery networks.

• Expertise in high-speed signaling design (>50GHz) and mitigating signal integrity challenges (crosstalk, reflections, impedance mismatches).

• Strong experience with CoWoS (Chip-on-Wafer-on-Substrate) interposer design and the impact of the substrate design to support CoWos.

• Advanced proficiency in Allegro Package Designer (including constraint management, routing, and design verification).

• Deep understanding of SI/PI principles and how they apply to package-level design.

• Strong analytical skills and ability to work effectively in a fast-paced, cross-functional team environment.

Benefits

• Full medical, dental, and vision packages, with 100% of premium covered

• Housing subsidy of $2,000/month for those living within walking distance of the office

• Daily lunch and dinner in our office

• Relocation support for those moving to Cupertino

How we’re different

Etched believes in the Bitter Lesson. We think most of the progress in the AI field has come from using more FLOPs to train and run models, and the best way to get more FLOPs is to build model-specific hardware. Larger and larger training runs encourage companies to consolidate around fewer model architectures, which creates a market for single-model ASICs.

We are a fully in-person team in Cupertino, and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.