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Kandou AI in Lausanne, Switzerland, is seeking an experienced Advanced R&D Analog Layout Engineer to own the physical realization of high-speed mixed-signal front-ends.
You will work with analog designers to translate schematics into silicon-ready layouts that meet performance, matching, parasitic, EM/IR and ESD targets, and you will support post-silicon characterization.
At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
The Analog Layout Engineer owns the physical realization of the mixed-signal front-ends of our high-speed chip-to-chip and die-to-die link IPs in advanced FinFET nodes. You will work hand-in-hand with analog designers to convert schematics into silicon-ready layouts that meet aggressive performance, matching, parasitic, EM/IR, and ESD targets — and you will follow the block through post-silicon characterization to close the loop between what was drawn and what measures.
Own the layout of one or more critical analog blocks (e.g., CTLE, PLL, ADC/DAC, LDO, high-speed I/O) and deliver DRC/LVS-clean, parasitic-verified layouts that meet block-level specification.
Establish and enforce matching, floor-planning, shielding, and power-grid strategies for the next-generation link, in close collaboration with the analog design team.
Support first-silicon bring-up and characterization, closing the loop between measured behavior and the parasitic / EM assumptions used at layout time.
Own the end-to-end physical implementation of assigned analog blocks: floor-planning, device placement, routing, power grid, ESD strategy, and DRC/LVS/PEX sign-off.
Partner with analog designers to interpret matching, parasitic, and shielding constraints, and to iterate quickly on post-layout performance.
Support IP-level and chip-level integration, including interaction with digital, packaging, and IP-delivery teams and with external customers.
Verify performance across process/voltage/temperature corners at post-layout, and drive parasitic reduction where needed to meet specification.
Support post-silicon bring-up, debug, and characterization on lab equipment; feed measured parasitic and layout observations back into future revisions.
Produce clear layout, verification, and progress reports; contribute to layout-level design reviews.
5+ years doing custom analog layout for multi-Gigabit SerDes transceivers (28 Gb/s and beyond), memory I/O, or HF/RF circuits.
Hands-on experience laying out the fundamental analog building blocks in modern FinFET technologies (28 nm, 14/16 nm, 7 nm): amplifiers, oscillators, PLLs/DLLs, biasing, buffers, regulators, filters, and data converters.
Working knowledge of matching constraints, parasitic minimization, power-grid design, and ESD requirements for high-speed circuits.
Proficient with the modern analog layout tool chain (Cadence Virtuoso, Spectre/HSPICE, Calibre/PVS DRC/LVS, parasitic extraction, EM/IR-drop and ESD analysis tools).
Awareness of power and thermal budgeting for high-speed IPs at reticle-scale packages.
Experience with reliability, EM, and aging analysis in advanced nodes.
Exposure to flip-chip package technologies and to package-aware floor-planning of the die.
Prior tape-out and silicon characterization in FinFET technologies
Deep understanding of high-speed, high-precision analog layout techniques, including matching, symmetry, shielding, and controlled- impedance routing.
Proficient with Cadence Virtuoso, Spectre/HSPICE, Calibre/PVS DRC/LVS, parasitic extraction and modeling, EM/IR-drop and ESD analysis tools.
Skilled in translating design intent (matching, parasitic budgets, shielding requirements) into concrete floor-plans and routing rules.
Strong analytical and problem-solving skills.
Self-motivated, with strong sense of ownership; comfortable managing workload against schedules and reporting to internal management and technical audiences.
MSc or BSc in electronics/electrical engineering (equivalent or higher), with a strong background in semiconductor physics.
https://kandou.ai/