Advanced R&D - Analog Layout Engineer

Kandou AI

Saint-Sulpice

Vor Ort

CHF 120.000 - 160.000

Vollzeit

Vor 6 Tagen
Sei unter den ersten Bewerbenden
Bewerbungsgenerator

Hebe dich für diese Rolle von der Masse ab — erstelle in etwa einer Minute einen maßgeschneiderten Lebenslauf und ein Anschreiben.

Schaffe es an den ATS-Filtern vorbei

Zusammenfassung

Kandou AI in Lausanne, Switzerland, is seeking an experienced Advanced R&D Analog Layout Engineer to own the physical realization of high-speed mixed-signal front-ends.

You will work with analog designers to translate schematics into silicon-ready layouts that meet performance, matching, parasitic, EM/IR and ESD targets, and you will support post-silicon characterization.

Qualifikationen

  • 5+ years of custom analog layout for high-speed SerDes, memory IO, or HF/RF circuits.
  • Experience laying out analog blocks in FinFETs (28 nm–7 nm).
  • Knowledge of matching constraints, parasitic minimization, power-grid and ESD for high-speed circuits.
  • Proficient with Cadence Virtuoso, Spectre/HSPICE, Calibre/PVS, and parasitic extraction tools.

Aufgaben

  • Own the end-to-end physical implementation of assigned analog blocks: floor-planning, placement, routing, power grid, ESD, DRC/LVS/PEX sign-off.
  • Collaborate with analog designers to meet matching, parasitic, shielding constraints and iterate on post-layout performance.
  • Support IP-level and chip-level integration with digital, packaging, and external customers.
  • Verify performance across process/voltage/temperature corners and drive parasitic reduction.
  • Support post-silicon bring-up, debugging, and characterization; feed observations into future revisions.
  • Produce layout, verification, and progress reports; participate in design reviews.

Kenntnisse

Analog layout
High-speed design
FinFET knowledge
Layout optimization
Electronics analysis

Ausbildung

BSc/MSc in electronics/electrical engineering

Tools

Cadence Virtuoso
Spectre/HSPICE
Calibre/PVS

Jobbeschreibung

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

Job title: Advanced R&D - Analog Layout Engineer
Location : Lausanne, Switzerland

The Analog Layout Engineer owns the physical realization of the mixed-signal front-ends of our high-speed chip-to-chip and die-to-die link IPs in advanced FinFET nodes. You will work hand-in-hand with analog designers to convert schematics into silicon-ready layouts that meet aggressive performance, matching, parasitic, EM/IR, and ESD targets — and you will follow the block through post-silicon characterization to close the loop between what was drawn and what measures.

Immediate key objective
  • Own the layout of one or more critical analog blocks (e.g., CTLE, PLL, ADC/DAC, LDO, high-speed I/O) and deliver DRC/LVS-clean, parasitic-verified layouts that meet block-level specification.

  • Establish and enforce matching, floor-planning, shielding, and power-grid strategies for the next-generation link, in close collaboration with the analog design team.

  • Support first-silicon bring-up and characterization, closing the loop between measured behavior and the parasitic / EM assumptions used at layout time.

Responsibility
  • Own the end-to-end physical implementation of assigned analog blocks: floor-planning, device placement, routing, power grid, ESD strategy, and DRC/LVS/PEX sign-off.

  • Partner with analog designers to interpret matching, parasitic, and shielding constraints, and to iterate quickly on post-layout performance.

  • Support IP-level and chip-level integration, including interaction with digital, packaging, and IP-delivery teams and with external customers.

  • Verify performance across process/voltage/temperature corners at post-layout, and drive parasitic reduction where needed to meet specification.

  • Support post-silicon bring-up, debug, and characterization on lab equipment; feed measured parasitic and layout observations back into future revisions.

  • Produce clear layout, verification, and progress reports; contribute to layout-level design reviews.

Required Experience
  • 5+ years doing custom analog layout for multi-Gigabit SerDes transceivers (28 Gb/s and beyond), memory I/O, or HF/RF circuits.

  • Hands-on experience laying out the fundamental analog building blocks in modern FinFET technologies (28 nm, 14/16 nm, 7 nm): amplifiers, oscillators, PLLs/DLLs, biasing, buffers, regulators, filters, and data converters.

  • Working knowledge of matching constraints, parasitic minimization, power-grid design, and ESD requirements for high-speed circuits.

  • Proficient with the modern analog layout tool chain (Cadence Virtuoso, Spectre/HSPICE, Calibre/PVS DRC/LVS, parasitic extraction, EM/IR-drop and ESD analysis tools).

  • Awareness of power and thermal budgeting for high-speed IPs at reticle-scale packages.

  • Experience with reliability, EM, and aging analysis in advanced nodes.

  • Exposure to flip-chip package technologies and to package-aware floor-planning of the die.

  • Prior tape-out and silicon characterization in FinFET technologies

Required Skills
  • Deep understanding of high-speed, high-precision analog layout techniques, including matching, symmetry, shielding, and controlled- impedance routing.

  • Proficient with Cadence Virtuoso, Spectre/HSPICE, Calibre/PVS DRC/LVS, parasitic extraction and modeling, EM/IR-drop and ESD analysis tools.

  • Skilled in translating design intent (matching, parasitic budgets, shielding requirements) into concrete floor-plans and routing rules.

  • Strong analytical and problem-solving skills.

  • Self-motivated, with strong sense of ownership; comfortable managing workload against schedules and reporting to internal management and technical audiences.

Required Education
  • MSc or BSc in electronics/electrical engineering (equivalent or higher), with a strong background in semiconductor physics.

https://kandou.ai/

Hol dir deinen kostenlosen, vertraulichen Lebenslauf-Check.
oder ziehe deine Datei hierhin.
Similar jobs

Ähnliche Jobs, die dir auch gefallen könnten

Advanced R&D Analog Design Engin - 2 openings
Advanced R&D Analog Design Engin - 2 openings

Kandou Bus SA • Saint-Sulpice

Vor Ort
CHF 100.000 - 130.000
Advanced R&D - Physical Design Engineer
Advanced R&D - Physical Design Engineer

Kandou AI • Saint-Sulpice

Vor Ort
CHF 120.000 - 170.000
Advanced R&D - Digital Design Engineer
Advanced R&D - Digital Design Engineer

Kandou AI • Saint-Sulpice

Vor Ort
CHF 150.000 - 190.000
Digital Design Engineer, UK, CH
Digital Design Engineer, UK, CH

Kandou Bus SA • Lausanne

Vor Ort
GBP 110.000 - 137.000
Senior IC Layout Engineer (F/M/D) 100%
Senior IC Layout Engineer (F/M/D) 100%

CSEM • Neuenburg

Vor Ort
CHF 100.000 - 130.000
Senior Layout Engineer
Senior Layout Engineer

Ignite Next GmbH • Zürich

Hybrid
CHF 120.000 - 180.000
Senior IC Layout Engineer – FinFET
Senior IC Layout Engineer – FinFET

IC Resources • Lausanne

Hybrid
CHF 120.000 - 190.000
Competitive salary
Pension
Private medical cover
+2
Senior IC Layout Engineer - FinFET
Senior IC Layout Engineer - FinFET

IC Resources • Lausanne

Hybrid
CHF 120.000 - 160.000
Pension
Private medical cover
Visa sponsorship
+1
Principal Analog IC Layout Engineer
Principal Analog IC Layout Engineer

IC Resources • Zürich

Vor Ort
CHF 85.000 - 113.000
Advanced R&D Modeling Engineer, CH
Advanced R&D Modeling Engineer, CH

Kandou Bus SA • Saint-Sulpice

Vor Ort
CHF 80.000 - 120.000