Senior Hardware Architect for High-Speed Imaging

FLIR Systems, Inc.; Southwestern Ontario; On-site; CAD 131,000 - 175,000; Full time

Job summary

Teledyne Digital Imaging seeks a System Design Engineer (Hardware) to shape the electronics behind next‑generation machine vision camera platforms. You will operate at the intersection of advanced electronics, high‑speed imaging and real‑world product performance.

You will set architectural direction, lead complex design challenges, and mentor multidisciplinary teams while influencing roadmaps and technology choices across programs.

Qualifications

• Bachelor’s degree in Electrical Engineering or related discipline required with 12+ years of relevant experience.
• Strong expertise in analog, digital, mixed-signal, power, and high-speed electronics design.
• Deep knowledge of PCB architecture, signal integrity, power integrity, and system integration.

Responsibilities

• Set technical direction for electronics architectures across machine vision camera platforms.
• Architect board-level solutions to improve performance, reliability and longevity.
• Lead resolution of complex analog, digital, mixed-signal, power and high-speed design challenges.
• Establish design methodologies and engineering standards across teams.
• Guide critical trade-offs involving performance, cost, manufacturability and business needs.
• Serve as a technical authority for design, production and customer-impacting challenges.
• Influence product roadmaps and future technology choices.
• Mentor engineers and strengthen technical capability across multidisciplinary teams.

Skills

Analog design

Digital design

Mixed-signal design

Power integrity

PCB architecture

Signal integrity

High-speed interfaces

Leadership & mentoring

Education

Bachelor’s degree in Electrical Engineering

Master’s or PhD in Electrical Engineering (advantage)

Job description

Teledyne Digital Imaging seeks a System Design Engineer (Hardware) to shape the electronics behind next‑generation machine vision camera platforms. You will operate at the intersection of advanced electronics, high‑speed imaging and real‑world product performance.

You will set architectural direction, lead complex design challenges, and mentor multidisciplinary teams while influencing roadmaps and technology choices across programs.