Hardware Technical Leader

FLIR Systems, Inc.; Southwestern Ontario; On-site; CAD 131,000 - 175,000; Full time

Job summary

Teledyne Digital Imaging seeks a System Design Engineer (Hardware) to shape the electronics behind next‑generation machine vision camera platforms. You will operate at the intersection of advanced electronics, high‑speed imaging and real‑world product performance.

You will set architectural direction, lead complex design challenges, and mentor multidisciplinary teams while influencing roadmaps and technology choices across programs.

Qualifications

• Bachelor’s degree in Electrical Engineering or related discipline required with 12+ years of relevant experience.
• Strong expertise in analog, digital, mixed-signal, power, and high-speed electronics design.
• Deep knowledge of PCB architecture, signal integrity, power integrity, and system integration.

Responsibilities

• Set technical direction for electronics architectures across machine vision camera platforms.
• Architect board-level solutions to improve performance, reliability and longevity.
• Lead resolution of complex analog, digital, mixed-signal, power and high-speed design challenges.
• Establish design methodologies and engineering standards across teams.
• Guide critical trade-offs involving performance, cost, manufacturability and business needs.
• Serve as a technical authority for design, production and customer-impacting challenges.
• Influence product roadmaps and future technology choices.
• Mentor engineers and strengthen technical capability across multidisciplinary teams.

Skills

Analog design

Digital design

Mixed-signal design

Power integrity

PCB architecture

Signal integrity

High-speed interfaces

Leadership & mentoring

Education

Bachelor’s degree in Electrical Engineering

Master’s or PhD in Electrical Engineering (advantage)

Job description

Be visionary Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research. We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Teledyne Digital Imaging is a subsidiary of Teledyne Technologies Inc., a U.S. publicly listed enterprise, and specializes in the manufacture, design, research and development of high-performance CMOS and CCD image sensors and modular expandable cameras. Teledyne Digital Imaging's products are used worldwide in high-speed machine vision, document scanning, image capture, surveillance, process monitoring, manufacturing inspection, medical imaging and multimedia. Teledyne Digital Imaging is looking for a System Design Engineer (Hardware) to help shape the electronics behind next-generation machine vision camera platforms. This is an opportunity to work at the intersection of advanced electronics, high-speed imaging, and real-world product performance. If you enjoy solving difficult technical problems, setting architectural direction, and helping engineering teams turn ambitious ideas into robust products, this role offers the chance to make an impact across multiple platforms and programs.

What you’ll do

Set technical direction for electronics architectures across machine vision camera platforms. Architect board-level solutions that improve performance, scalability, reliability, and product longevity. Lead resolution of complex analog, digital, mixed-signal, power, and high-speed design challenges. Establish design methodologies and engineering standards across teams. Guide critical trade-offs involving performance, cost, manufacturability, and business needs. Serve as a technical authority for design, production, and customer-impacting challenges. Influence product roadmaps and future technology choices. Mentor engineers and strengthen technical capability across multidisciplinary teams.

Required

• Required: Expert-level analog, digital, mixed-signal, power, and high-speed electronics design skills.
• Required: Deep knowledge of PCB architecture, signal integrity, power integrity, and system integration.
• Required: Experience with ADCs/DACs, SMPS/LDOs, op-amps, FPGAs, microcontrollers, fiber optics, and high-speed interfaces.
• Required: Demonstrated ability to lead, influence, and mentor multidisciplinary engineering teams.
• Required: Proven experience driving complex projects, architectural decisions, and technical innovation.
• Required: Strong technical communication, proposal development, and stakeholder presentation skills.
• Required: Bachelor’s degree in electrical engineering or related discipline and typically 12+ years of relevant experience.
• Advantage: Master’s or PhD in Electrical Engineering.

What we offer

Work on sophisticated imaging technologies with real-world applications. Deep technical challenges spanning electronics, imaging, and system integration. Opportunities to collaborate across engineering disciplines and business functions. An environment where technical leadership and innovation have meaningful product impact. Opportunities to mentor others while continuing to grow your own technical depth.

Salary Range

$93,700.00-$124,900.000

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.