Senior ASIC Package Automation & AI Engineer

AMD; Markham; On-site; CAD 110,000 - 160,000; Full time

Job summary

AMD in Markham, Ontario seeks a highly motivated engineer to advance the package design automation program. You will develop, deploy, and maintain AI-assisted workflows for substrate, interposer, and bridge-based integration, aiming to improve efficiency and design quality.

You will collaborate with Design, EDA, and AI/ML teams to translate complex challenges into scalable automation, apply AI/ML to routing, placement, and verification, and help accelerate next‑generation packaging innovation.

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science or related field.
• Experience in semiconductor packaging or SOC physical design automation.
• Proficiency with scripting languages (Python, Tcl, SKILL) and/or C++.
• Experience applying AI/ML to design workflows.
• Familiarity with DRC/LVS and SI/PI fundamentals.
• Ability to collaborate across design, SI/PI, mechanical, and EDA teams.

Responsibilities

• Develop, deploy, and maintain automation frameworks and AI-assisted workflows for package substrates, interposers, and bridge-based integration.
• Apply AI/ML to routing, placement optimization, signal integrity, and power delivery improvements.
• Collaborate with package design teams to identify automation opportunities, reduce manual design effort, and improve quality.
• Partner with EDA tools teams and vendors to implement new automation features.
• Develop integration and data-extraction tools and support design milestones and tape-outs.
• Contribute to documentation, best practices, and reusable workflows.

Skills

Semiconductor packaging

EDA tooling experience

Automation & scripting

AI/ML in engineering

Cross-functional collaboration

Education

Bachelor's degree in Electrical Engineering, Computer Engineering, CS or related

Tools

Cadence APD/SiP

Siemens Xpedition

Synopsys 3DIC

Python

Tcl

C++

Job description

AMD in Markham, Ontario seeks a highly motivated engineer to advance the package design automation program. You will develop, deploy, and maintain AI-assisted workflows for substrate, interposer, and bridge-based integration, aiming to improve efficiency and design quality.

You will collaborate with Design, EDA, and AI/ML teams to translate complex challenges into scalable automation, apply AI/ML to routing, placement, and verification, and help accelerate next‑generation packaging innovation.