Senior ASIC Package Design Automation and AI Engineer

AMD; Markham; On-site; CAD 110,000 - 160,000; Full time

Job summary

AMD in Markham, Ontario seeks a highly motivated engineer to advance the package design automation program. You will develop, deploy, and maintain AI-assisted workflows for substrate, interposer, and bridge-based integration, aiming to improve efficiency and design quality.

You will collaborate with Design, EDA, and AI/ML teams to translate complex challenges into scalable automation, apply AI/ML to routing, placement, and verification, and help accelerate next‑generation packaging innovation.

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science or related field.
• Experience in semiconductor packaging or SOC physical design automation.
• Proficiency with scripting languages (Python, Tcl, SKILL) and/or C++.
• Experience applying AI/ML to design workflows.
• Familiarity with DRC/LVS and SI/PI fundamentals.
• Ability to collaborate across design, SI/PI, mechanical, and EDA teams.

Responsibilities

• Develop, deploy, and maintain automation frameworks and AI-assisted workflows for package substrates, interposers, and bridge-based integration.
• Apply AI/ML to routing, placement optimization, signal integrity, and power delivery improvements.
• Collaborate with package design teams to identify automation opportunities, reduce manual design effort, and improve quality.
• Partner with EDA tools teams and vendors to implement new automation features.
• Develop integration and data-extraction tools and support design milestones and tape-outs.
• Contribute to documentation, best practices, and reusable workflows.

Skills

Semiconductor packaging

EDA tooling experience

Automation & scripting

AI/ML in engineering

Cross-functional collaboration

Education

Bachelor's degree in Electrical Engineering, Computer Engineering, CS or related

Tools

Cadence APD/SiP

Siemens Xpedition

Synopsys 3DIC

Python

Tcl

C++

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology can change lives for the better. It can heal us, entertain us, and make us more connected, productive, and understanding of the world around us. And we’re looking for talent who feel the same: people who want to leave the planet better than they found it, those who don’t shy away from humanity’s challenges but are determined to help solve them.

The Role

We are seeking a highly motivated and seasoned engineer to support the package design organization in the development and deployment of AI-driven automation workflows. This role will focus on improving the efficiency, quality, and scalability of complex package, bridge, and interposer design. The candidate will contribute to accelerating the design of advanced heterogeneous integration technologies, including substrates, silicon interposers, and bridge-based architectures, through automation, and AI-enabled methodologies. This role operates in a fast-paced, results-oriented environment and plays a critical part in enabling next-generation packaging innovation.

The Person

• Translate complex design challenges into scalable automation solutions
• Work effectively across Design, EDA, and AI/ML teams
• Demonstrate strong problem-solving skills and ownership mindset
• Operate with limited supervision, delivering high-quality results aligned to project goals
• The candidate should be comfortable working in a multi-disciplinary environment and have strong communication skills to collaborate across internal and external stakeholders.

Key Responsibilities

• Develop, deploy, and maintain automation frameworks and AI-assisted workflows for Package substrates, silicon interposers and bridge-based integration.
• Apply AI/ML methodologies to enhance key design activities such as auto-routing and placement optimization, signal integrity and power delivery improvements, design rule compliance and verification.
• Collaborate with package design team to identify high-impact automation opportunities, reduce manual design effort and cycle time, improve design robustness and quality.
• Partner with EDA tools teams and vendors to implement automation features, enhance tool capabilities and workflows, support next-generation advanced packaging design enablement
• Develop automation and tools to enable design flow integration, data extraction and analysis, closed-loop optimization with simulation teams
• Support execution of design milestones and tape-outs, ensuring automation readiness and quality
• Contribute to documentation, best practices, and reusable workflows for broader team adoption

Preferred Experience

• Experience in semiconductor packaging or SOC physical design automation
• Strong working knowledge of EDA packaging tools such as Cadence APD / SiP, Siemens Xpedition and Synopsys 3DICC or equivalent
• Expertise in scripting and automation using Python (preferred), Tcl, SKILL, or C++
• Experience applying AI/ML techniques to engineering or design workflows. Familiarity with frameworks such as PyTorch or TensorFlow .
• Understanding of advanced packaging technologies such as 2.5D / 3D IC, Chiplets and heterogeneous integration, Bridge/interposer-based architectures
• Familiarity with Design verification flows (DRC/LVS), Parasitic extraction and SI/PI fundamentals
• Experience working with cross-functional teams (Design, SI/PI, Mechanical, EDA)

Academic Credentials

• Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, Computer Science or related field.

Benefits offered are described: AMD benefits at a glance.

AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.