Senior 6G RF Packaging Engineer for 2D/3D Integration

Huawei Technologies Co.; Ottawa; On-site; CAD 106,000 - 156,000; Full time

Job summary

Huawei Canada in Ottawa seeks an Engineer to advance wireless technology in a cutting-edge lab. The role emphasizes RF/microwave packaging, interposer design, and 2.5D/3D integration with hands-on lab work and test-vehicle development.

You will collaborate with RFIC, antenna, materials, and manufacturing teams, coordinate VNA and OTA measurements, and contribute to patents and publications while driving cross-disciplinary research in a dynamic environment.

Qualifications

• PhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or related field (or equivalent advanced R&D experience).
• 5 years of relevant industry experience.
• Deep knowledge of RF/microwave principles.
• Experience using full-wave EM and circuit simulation tools to model packages and correlate results with measurements.
• Hands-on experience designing test vehicles and directing microelectronics assembly (PCB, flip-chip, wire bonding, SMT, molding).
• Proficiency with RF lab equipment (VNAs), probe station.
• Working knowledge of thermal management, CTE mismatch, stress, warpage, and reliability testing.

Responsibilities

• Explore 2.5D/3D integration, wafer-level packaging, diverse interposers, and embedded passives.
• Study low-loss die-to-die and die-to-package interfaces, including micro-bumps, vias, and waveguide structures.
• Develop embedded shielding, isolation structures, and localized cooling for high-power RF arrays.
• Investigate additively manufactured RF structures and engineered materials for prototyping advantages.
• Perform full-wave EM simulations to quantify interconnect loss, leakage, coupling, and noise.
• Design package transitions, antenna feeds, and grounding networks across die, substrate, and board boundaries.
• Coordinate VNA, thermal, and OTA array measurements to evaluate system-level package performance.
• Partner with internal specialists (RFIC, antenna, materials, manufacturing) to frame cross-disciplinary research.
• Secure patents and invention disclosures while publishing papers and internal technical reports.

Skills

RF/microwave principles

Full-wave EM simulations

Package design & interconnects

Test vehicle design

RF lab equipment (VNAs)

Thermal management knowledge

Cross-disciplinary collaboration

Education

PhD in Electrical Engineering or related field

Equivalent advanced R&D experience

Tools

VNAs

Probe station

Full-wave EM simulators

Circuit simulators

Thermal analysis tools

Job description

Huawei Canada in Ottawa seeks an Engineer to advance wireless technology in a cutting-edge lab. The role emphasizes RF/microwave packaging, interposer design, and 2.5D/3D integration with hands-on lab work and test-vehicle development.

You will collaborate with RFIC, antenna, materials, and manufacturing teams, coordinate VNA and OTA measurements, and contribute to patents and publications while driving cross-disciplinary research in a dynamic environment.