Engineer - 6G RF Packaging

Huawei Canada; Ottawa; On-site; CAD 106,000 - 156,000; Full time

Job summary

Huawei Canada in Ottawa is seeking an Engineer to advance wireless packaging and high‑power RF array integration. You will collaborate with RFIC, antenna, materials, and manufacturing teams to design 2.5D/3D integration, wafer‑level packaging, and embedded passives.

The role requires a PhD or equivalent R&D experience, 5 years in industry, deep knowledge of RF/microwave principles, and hands‑on use of full‑wave EM tools.

Qualifications

• PhD or equivalent advanced R&D experience in related field.
• 5 years of relevant industry experience.
• Deep knowledge of RF/microwave principles.
• Hands-on experience with test vehicles and RF lab equipment.
• Proficiency with full-wave EM and circuit simulation tools.

Responsibilities

• Explore 2.5D/3D integration, wafer‑level packaging, diverse interposers, and embedded passives.
• Study low‑loss die‑to‑die and die‑to‑package interfaces, including micro‑bumps, vias, and waveguide structures.
• Develop embedded shielding, isolation structures, and localised cooling for high‑power RF arrays.
• Investigate additively manufactured RF structures and engineered materials for prototyping advantages.
• Perform full‑wave EM simulations to quantify interconnect loss, leakage, coupling, and noise.
• Design package transitions, antenna feeds, and grounding networks across die, substrate, and board boundaries.
• Coordinate VNA, thermal, and OTA array measurements to evaluate system‑level package performance.
• Partner with internal specialists (RFIC, antenna, materials, manufacturing) to frame cross‑disciplinary research.
• Secure patents and invention disclosures while publishing papers and internal technical reports.

Skills

RF/Microwave principles

Full-wave EM simulation

Circuit simulation tools

Test vehicle design

RF lab equipment

Education

PhD in Electrical Engineering, RF/Microwave Engineering, Packaging

Tools

PCB fabrication

Flip-chip

Wire bonding

SMT

Molding

Job description

Huawei Canada has an immediate permanent opening for an Engineer.

About the team:

Welcome to the Advanced Wireless Technology Wireless Lab, an epitome of innovation located in Ottawa, Canada. Here, amid the dynamic panorama of technological progress, our team consists mainly of seasoned graduate computer engineers and computer scientists. With diverse experiences ranging from fresh perspectives to decades‑long industry immersion, we are united by our fervour for pioneering wireless solutions.

About the job:

• Explore 2.5D/3D integration, wafer‑level packaging, diverse interposers, and embedded passives.
• Study low‑loss die‑to‑die and die‑to‑package interfaces, including micro‑bumps, vias, and waveguide structures.
• Develop embedded shielding, isolation structures, and localised cooling for high‑power RF arrays.
• Investigate additively manufactured RF structures and engineered materials for prototyping advantages.
• Perform full‑wave EM simulations to quantify interconnect loss, leakage, coupling, and noise.
• Design package transitions, antenna feeds, and grounding networks across die, substrate, and board boundaries.
• Coordinate VNA, thermal, and OTA array measurements to evaluate system‑level package performance.
• Partner with internal specialists (RFIC, antenna, materials, manufacturing) to frame cross‑disciplinary research.
• Secure patents and invention disclosures while publishing papers and internal technical reports.

The total target annual compensation for this position ranges from $106,000 to $156,000 depending on education, experience, and demonstrated expertise.

About the ideal candidate:

• 5 years of relevant industry experiences.
• PhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or a related field (or equivalent advanced R&D experience).
• Deep knowledge of RF/microwave principles.
• Experience using full‑wave EM and circuit simulation tools to model packages and correlate results with measure.
• Hands‑on experience designing test vehicles and directing microelectronics assembly (e.g., PCB, flip‑chip, wire bonding, SMT, molding).
• Proficiency with RF lab equipment (VNAs), probe station.
• Working knowledge of thermal management, CTE mismatch, stress, warpage, and reliability testing.

Additional Information:

Huawei Canada is committed to a fair, inclusive, and accessible recruitment process. If you require accommodation during any stage of the hiring process, please let us know and we will work with you to meet your needs.

we do not use artificial intelligence tools to screen or select candidates. All applications for this position are reviewed directly by our hiring team.