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Principal Analog Mixed-Signal Design Engineer

Fox Point Recruitment LLC

Ottawa

Hybrid

USD 145,000 - 216,000

Full time

3 days ago
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Job summary

A leading company seeks a Principal Analog Mixed-Signal Design Engineer to drive the design of advanced RF and analog circuits, including transmission lines and millimeter-wave structures. This hybrid role offers a competitive salary, focusing on technical leadership in high-performance circuit design and mentoring junior engineers.

Benefits

Flexible time off
401k plan
Paid time off to volunteer
Year-end shutdown
Floating holidays

Qualifications

  • 10-15 years of experience in RF/Analog Receiver design.
  • Proven IC design experience including chip tape-out.
  • Strong fundamentals with experience in high-precision analog circuits.

Responsibilities

  • Design and validate high-speed broadband ICs.
  • Lead design of transimpedance amplifiers in SiGe BiCMOS technology.
  • Collaborate with teams for post-silicon validation and mass production.

Skills

Analog Circuit Design
RF Design
Circuit Validation
Mentoring

Education

Bachelor's degree in Electrical Engineering
MSc in Electrical Engineering
PhD in Electrical Engineering

Tools

EDA CAD tools

Job description

Principal Analog Mixed-Signal Design Engineer
About the job Principal Analog Mixed-Signal Design Engineer

Job Locations:

Hybrid - 2 days a week minimum in one of these office Locations:

  • Irvin, CA
  • Westlake Village, CA

Job Summary

Our client is seeking an RF and Analog Design Engineer to contribute to the development of multi-tens of GHz Transimpedance amplifiers TIAs. As a member of the design group, the candidate will be responsible for design and validation of FET and BiCMOS circuits for high-speed broadband ICs that serve these applications.

Responsibilities

In this role you will be responsible for:

  • Active circuit design as well as technical leadership.
  • Designing leading edge transimpedance amplifier design, primarily in Silicon Germanium (SiGe) BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) technology, where circuit performance will need to transcend beyond industry leading products.
  • Developing transmission line structures and other millimeter wave structures to enable higher performance than would normally be achievable.
  • Design of hi-performance broadband analog circuits for optical front-end receivers.
  • Design of various other analog circuits including linear regulators, AGC loop, current/voltage sensors, bandgaps etc.
  • Developing microarchitecture of major circuit blocks and guide team of designers to implement them. Work with various technologies including SiGe BiCMOS and CMOS.
  • Working with other functional groups to facilitate post-silicon validation, qualification, transition to mass production, and customer support.

Qualifications & Experience

  • Bachelors degree in Electrical Engineering in the areas of design of high-performance RF/Analog Receiver/TIA design and 10 - 15 years experience
  • Or MSc EE Or PhD EE with 5+ years of experience in the areas of design of high-performance RF/Analog Receiver/TIA design.
  • Proven experience in IC design including chip tape-out AND lab evaluation of receiver design working in the industry).
  • Solid experience in.
    • Using EDA CAD tools
    • Performing Analog Custom Layout
  • Experience in measuring IC performance and debug of design to correlate simulations to measurements
  • Deep understanding of fundamentals, including:
    • Detailed transistor level design
    • Device physics
    • Control/Feedback loop stability analysis
  • Direct project experience in at least one of the following areas is a plus:
    • AGC loop design
    • High precision analog circuits (Including linear regulators, current sensors, bandgaps and DAC/ADC)
    • Experience in CTLE design
  • Project experience in using different technologies. (SiGe BiCMOS is a plus)
  • Experience in the following is a strong plus:
    • Overseeing and mentoring junior circuit designers
    • Experience as chip lead with success in silicon
    • Experience in taking chips to mass production
    • Ability to translate chip level specifications into architecture
  • Strong communication, presentation and documentation skills.

Expected Base Pay Range (USD)

145,300 - 215,010, $ per annum

The successful candidates starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

  • Our client offers a total compensation package with a base, bonus and equity.
  • Health and financial wellbeing are part of the package. That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer.
  • This role is eligible for our hybrid work model in which you will be able to split time between working from home and on-site in the office.
  • All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
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