PCB Layout Intern

Semtech Canada Corporation

Burlington

On-site

CAD 36,000 - 39,000

Full time

12 days ago

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

Semtech Corporation's Burlington Design Center is seeking a student intern to contribute to high-speed board design and assembly for semiconductor product evaluation. You will work with product development and applications teams—locally and remotely—developing internal and customer-facing hardware and gaining exposure to cutting-edge design tools and technologies.

The internship is on-site in Burlington, ON, for up to 16 months, with a 40-hour week from Monday to Thursday.

Qualifications

  • Strong debugging skills.
  • Experience with Cadence Allegro for PCB layout.
  • Experience with Autodesk Fusion for mechanical design.
  • Familiarity with RF and high-speed digital (>10Gbps) design.
  • Knowledge of optical and high-speed test equipment.
  • Excellent cross-functional team and leadership skills.
  • Good communication and organizational skills.
  • Team player with a customer-focused mindset.
  • Highly motivated, goal-driven, self-starter.

Responsibilities

  • PCB Design & Layout: Develop evaluation platforms and perform schematic capture, PCB layout, and SI analysis using Cadence Allegro/OrCAD.
  • Mechanical & Cross-Functional Support: Design fixtures, housings, and thermal solutions; collaborate across teams.

Skills

Debug skills
Cross-functional teamwork
Communication
Leadership
Motivation
Customer focus
Self-starter

Tools

Cadence Allegro
Autodesk Fusion

Job description

Location: Burlington, ON, Canada

Reporting to: Manager, Hardware Engineering

Our Team:

Semtech Corporation designs innovative semiconductor solutions and intellectual property cores for the world's most advanced consumer connectivity and data communications products. Within our Signal Integrity Products business unit, our Hardware Design team is currently looking for a student intern for a period of up to 16 months at our Burlington, ON Design Center.

Job Summary:

As a full member of our Hardware Design group, you will contribute by delivering innovative high-speed board design and assembly for the purpose of performance measurement of semiconductor products. You'll work alongside our product development and applications teams — both locally and remotely — developing internal and customer-facing hardware, and gain exposure to leading-edge design tools and technologies used across both our Applications and Hardware teams. This role offers a strong opportunity for growth and development in card design and electrical modeling, working in parallel with several cross-functional teams internally.

Our approach to internship is to make you a full, integrated part of our team. We believe the best learning comes through direct involvement, so you'll start with tasks that let you learn and contribute at the same time — as your skills grow, so will the complexity of what you take on. Our internship program is an important part of our recruiting strategy.

Please note that this is an on-site position, requiring you to be in the office Monday to Thursday for a 40-hour work week.

Responsibilities:
PCB Design & Layout
  • Work with senior engineers to develop evaluation platforms using cutting-edge bills of material, design tools, and manufacturing design rules.
  • Perform schematic capture, PCB layout, and system-level signal integrity analysis and optimization using platforms such as Cadence Allegro/OrCAD.
Mechanical & Cross-Functional Support
  • Support mechanical design of fixtures, housings, and thermal solutions using Autodesk Fusion.
  • Interface in parallel with several cross-functional teams internally to support evaluation platform development.
Minimum Qualifications:
  • Strong debug skills.
  • Experience with Cadence Allegro for PCB layout.
  • Experience with Autodesk Fusion for mechanical design.
  • Familiarity with RF and high-speed digital (>10Gbps) design.
  • Knowledge of optical and high-speed test equipment.
  • Excellent cross-functional team and leadership skills.
  • Good communication and organizational skills.
  • Team player with a customer-focused mindset.
  • Highly motivated, goal-driven, self-starter.

Semtech, an equal opportunity employer, values the diversity, knowledge and expertise of our workforce. Success, Ethics, Respect and Alignment are the foundational values of our business and guide our relationships with employees, shareholders, customers and other stakeholders.

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

We may leverage Artificial Intelligence (AI) tools to enhance efficiency during candidate screening, assessment, and recruitment. Final hiring decisions remain with our Hiring Teams, not AI systems.

A reasonable estimate of the pay range for this position is $26 - $28.50 CAD per hr . There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee's total compensation package.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

PCB Layout Intern
PCB Layout Intern

Semtech • Burlington

On-site
CAD 36,000 - 39,000
Senior Package Layout Engineer
Senior Package Layout Engineer

Semtech • Burlington

On-site
CAD 105,000 - 122,000
Senior Package Layout Engineer
Senior Package Layout Engineer

Semtech • Calgary

On-site
CAD 105,000 - 122,000
Senior Package Layout Engineer
Senior Package Layout Engineer

semtech • Ottawa

On-site
CAD 105,000 - 122,000
IC Packaging Design Intern
IC Packaging Design Intern

Sierra Wireless • Ottawa

On-site
CAD 36,000 - 40,000
Analog Design Engineer Intern
Analog Design Engineer Intern

Semtech • Burlington

On-site
CAD 36,000 - 39,000
Senior PCB Design Engineer
Senior PCB Design Engineer

Semtech • Burlington

On-site
CAD 148,578 - 176,878
Applications Engineering Intern
Applications Engineering Intern

Sierra Wireless • Burlington

On-site
CAD 36,000 - 40,000
Digital IC Design Engineering Intern
Digital IC Design Engineering Intern

Sierra Wireless • Ottawa

On-site
CAD 36,000 - 39,000
Digital IC Design Engineering Intern
Digital IC Design Engineering Intern

Sierra Wireless • Burlington

On-site
CAD 36,000 - 39,000