AI Hardware & SoC Intern: Help Build Next-Gen Chips

Tenstorrent; Ottawa; On-site; CAD 90,000 - 120,000; Full time

Job summary

Tenstorrent is seeking contributors at various seniorities for hardware architecture and AI hardware & SoC work. You will help define system, CPU, memory and interconnect decisions, verify integration, and ensure silicon-ready designs.

The role spans architecture, RTL, and performance modeling with collaboration across multiple teams. You will learn to translate specifications into RTL, evaluate architectural tradeoffs with data, and work with cross-functional teams to deliver high-performance

Qualifications

• Pursuing BS, MS, or PhD in EE/ECE/CE/CS with strong project work.
• Experience with digital design, architecture and performance modeling.
• Willingness to own and deliver on AI hardware projects.

Responsibilities

• Participate in SoC-level architecture and fabric/interconnect design decisions.
• Contribute to RTL design, verification, and timing analysis.
• Model performance and power for AI workloads and systems.
• Collaborate across Architecture, RTL, Software and Physical Design teams.

Skills

Python

C/C++

RTL design

Performance modeling

Education

BS/MS/PhD in EE/ECE/CE/CS

Tools

RISC-V

FPGA

ASIC design tools

Job description

Tenstorrent is seeking contributors at various seniorities for hardware architecture and AI hardware & SoC work. You will help define system, CPU, memory and interconnect decisions, verify integration, and ensure silicon-ready designs.

The role spans architecture, RTL, and performance modeling with collaboration across multiple teams. You will learn to translate specifications into RTL, evaluate architectural tradeoffs with data, and work with cross-functional teams to deliver high-performance