Principal Engineer – NAND Process Pathfinding – Dry Etch

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Região Norte; Presencial; BRL 350 000 - 700 000; Tempo integral

Resumo da oferta

Micron Semiconductor Asia Operations Pte Ltd in Brazil seeks a Principal Engineer – Dry Etch to lead advanced dry etch process development for NAND technology, managing new chambers and interfacing with process integration and other domains.

The role emphasizes developing plasma chemistries and equipment capabilities, applying AI/ML analytics, and guiding the path to targets while collaborating with multiple engineering teams across semiconductor fabrication.

Qualificações

• Practical experience with ICP and CCP plasma etch technologies in semiconductor process development.
• Strong understanding of plasma-surface interactions, etch chemistry, profile control, and dry etch equipment fundamentals.
• Solid foundation in plasma physics, materials interactions, and semiconductor process integration.
• Experience in developing and refining dry etch processes for advanced semiconductor technologies.
• Familiarity with statistical analysis, data analytics, and process optimization methodologies.
• Strong cooperative abilities with the capacity to work efficiently across multidisciplinary engineering teams.

Responsabilidades

• Explore advanced dry etch methods to satisfy structural, electrical, yield, and integration demands throughout the NAND technology roadmap.
• Develop new plasma chemistries, process technologies, and equipment capabilities to enable future technology nodes.
• Apply advanced data analytics, AI/ML tools, and statistical methodologies to accelerate process learning and improve etch performance.
• Drive process pathfinding through automation, predictive modeling, and data-driven decision making.
• Work closely with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP, and Device teams to drive technology development and manufacturability forward.
• Leverage AI-enabled engineering tools, advanced analytics, and digital workflows to accelerate process development, improve decision-making, enhance knowledge management, and increase R&D productivity across thin film technology initiatives.

Conhecimentos

ICP/CCP plasma etch

plasma-surface interactions

data analytics

AI/ML tools

cross-functional collaboration

machine learning applications

Formação académica

PhD/MS in relevant field

Ferramentas

AI/ML tools

Descrição da oferta de emprego

Welcome to Micron's Advanced NAND Process Pathfinding Team — where the next generation of memory technology is developed. We operate at the groundbreaking forefront of semiconductor innovation, engineering world-class memory solutions built for uncompromising performance. If you're ready to redefine what's possible in NAND process technology, we'd love you on this journey with us.

As a Principal Engineer – Dry Etch, you will be part of an innovative Advanced NAND research & development dry etch team. This role offers significant opportunities for inventive work, cooperation, and pushing boundaries with Advanced NAND. You will engage directly with process integration and other process domains including Wet etch, CVD, Diffusion, Metals, Lithography & CMP. You will manage brand new and high-performance dry etch chambers and lead the process roadmap to fulfill program and yield targets.

Responsibilities:

• Explore advanced dry etch methods to satisfy structural, electrical, yield, and integration demands throughout the NAND technology roadmap.
• Develop new plasma chemistries, process technologies, and equipment capabilities to enable future technology nodes.
• Apply advanced data analytics, AI/ML tools, and statistical methodologies to accelerate process learning and improve etch performance.
• Drive process pathfinding through automation, predictive modeling, and data-driven decision making.
• Work closely with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP, and Device teams to drive technology development and manufacturability forward.
• Leverage AI-enabled engineering tools, advanced analytics, and digital workflows to accelerate process development, improve decision-making, enhance knowledge management, and increase R&D productivity across thin film technology initiatives.

Minimum Qualifications:

• Practical experience with ICP and/or CCP plasma etch technologies in semiconductor process development.
• Strong understanding of plasma-surface interactions, etch chemistry, profile control, and dry etch equipment fundamentals.
• Solid foundation in plasma physics, materials interactions, and semiconductor process integration.
• Experience in developing and refining dry etch processes for advanced semiconductor technologies.
• Familiarity with statistical analysis, data analytics, and process optimization methodologies.
• Strong cooperative abilities with the capacity to work efficiently across multidisciplinary engineering teams.

Preferred Qualifications:

• PhD/MS with 7–10 years of relevant experience in dry etch / semiconductor process development.
• Experience with high aspect ratio etch, advanced pattern transfer, selective etch, and structural process optimization.
• Experience applying machine learning, predictive modeling, automation, or virtual process modeling to technology development.
• Strong problem-solving abilities and the capacity to work autonomously in a dynamic development setting.
• Excellent communication and presentation skills.
• Experience mentoring engineers or leading technical projects is beneficial.

Join a team where curiosity is currency, collaboration is culture, and your work directly develops the memory that powers AI, mobile, automotive, and data center innovation worldwide. If advancing the boundaries of NAND technology excites you, this is where you belong!