PQE Electrical Failure Analysis

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Região Norte; Presencial; BRL 120 000 - 180 000; Tempo integral

Resumo da oferta

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD is seeking an experienced QEM PQE Electrical Failure Analysis Engineer to drive deep technical understanding and resolution of yield, quality, and reliability challenges for NAND memory products manufactured in Fab10.

You will perform die-level electrical analysis, construct failure models, and design bench DOE to enable robust qualification and continuous yield improvement.

Qualificações

• Bachelor’s or Master’s degree in Electronics, Microelectronics, Material Science, Physics, or Applied Science.
• Excellent problem-solving and analytical skills.
• Proven ability to communicate effectively both written and verbal to all levels.
• Proven ability to multi-task complex projects and drive them to completion.
• Strong teamwork skills and ability to build peer relationships.
• Knowledge of circuit analysis and layout tracing, yield analysis and failure mechanisms.
• Understanding of NAND memory operation, CMOS device physics and wafer fabrication processes.
• Hands-on experience in electrical failure analysis, bench characterization, probe testing, data analysis and DOE methodology.
• Ability to apply baseline digital fluency and AI literacy for research and problem solving.

Responsabilidades

• Perform electrical failure analysis (EFA) using bench characterization to identify failure mechanisms at die, circuit, and transistor levels.
• Construct failure models and root cause understanding for yield excursion, reliability issues, and customer return cases.
• Design and execute bench DOE and probe engineering experiments to validate hypotheses and drive yield/quality improvement.
• Translate characterization results into test, process, or device optimization solutions to improve yield, reliability, and product quality.
• Conduct circuit and layout tracing analysis to correlate electrical failure signatures to physical/process limitations.
• Support NPI qualification and HVM issue resolution, ensuring timely product release and manufacturing stability.
• Drive data-driven yield improvement programs through cross-functional collaboration.
• Troubleshoot complex issues across test conditions, probe limitations, and device design interactions.
• Develop custom test conditions, scripts, and methodologies for advanced failure validation and experiment execution.
• Contribute to process capability improvement and cost reduction initiatives by resolving abnormal manufacturing behaviors.
• Integrates AI-assisted tools and insights into daily work, ensuring responsible use and compliance with standards.
• Contributes to a culture of continuous improvement by identifying and sharing AI-enabled enhancements.

Conhecimentos

Problem solving

Analytical skills

Communication

Multi-tasking

Teamwork

Fabrication knowledge

AI literacy

Formação académica

Bachelor’s / Master’s Degree in Electronics/Microelectronics/Material Science/Physics/Applied Science

Ferramentas

AI-enabled tools

Probe testing

Descrição da oferta de emprego

Job Description

Job Description:

As a QEM PQE Electrical Failure Analysis (EFA) Engineer, you will be responsible for driving deep technical understanding and resolution of yield, quality, and reliability challenges for advanced NAND memory products manufactured in Fab10.

You will support both new product introduction (NPI) and high-volume manufacturing (HVM) by performing die-level electrical analysis, failure mode construction, and innovative characterization to enable robust product qualification and continuous yield improvement. Leveraging strong knowledge in device physics, probe testing, and wafer fabrication processes, you will identify root causes of electrical failures and translate insights into actionable test, process, and design improvements to enhance product performance and outgoing quality.

Job Responsibility:

• Perform electrical failure analysis (EFA) using bench characterization to identify failure mechanisms at die, circuit, and transistor levels

• Construct failure models and root cause understanding for yield excursion, reliability issues, and customer return cases

• Design and execute bench DOE and probe engineering experiments to validate hypotheses and drive yield/quality improvement

• Translate characterization results into test, process, or device optimization solutions to improve yield, reliability, and product quality

• Conduct circuit and layout tracing analysis to correlate electrical failure signatures to physical/process limitations

• Support NPI qualification and HVM issue resolution, ensuring timely product release and manufacturing stability

• Drive data-driven yield improvement programs through close collaboration with cross-functional teams (PI, TD, PE, TSE, YE)

• Troubleshoot complex issues across test conditions, probe limitations, and device design interactions

• Develop custom test conditions, scripts, and methodologies for advanced failure validation and experiment execution

• Contribute to process capability improvement and cost reduction initiatives by resolving abnormal manufacturing behaviors

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment andcomplying withorganizational standards and legal requirements.

• Contributes to a culture of continuous improvement byidentifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Requirements:

• Bachelor’s / Master’s Degree in Electronics/Microelectronics/Material Science/Physics/Applied Science

• Excellent problem-solving and analytical skills.

• Proven ability to communicate effectively both written and verbal to all level.

• Proven ability in multi-tasking complex projects and driving them to completion.

• Strong teamwork skills and the ability to build strong peer relationships

• Knowledge of Circuit analysis and layout tracing, Yield analysis and failure mechanisms

• Strong understanding of NAND memory operation and architecture, CMOS device physics and wafer fabrication processes

• Hands-on experience in Electrical failure analysis, bench characterization, Probe testing and test flow understanding, Data analysis and DOE methodology

• Ability to apply baseline digital fluency androle‑appropriate AIliteracy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Embody Micron’s core values:

People – Respect, develop, and empower others
Innovation – Drive continuous improvement and breakthrough thinking
Tenacity – Show grit and determination
Collaboration – Build trust and foster teamwork
Customer Focus – Deliver excellence and value