Snr/Engineer - Die Attach/Process Engineering

STATS ChipPAC Pte. Ltd.; Região Norte; Sur place; BRL 60 000 - 90 000; Plein temps

Résumé du poste

STATS ChipPAC Pte. Ltd. in Brazil seeks a process engineer to drive continuous improvements in semiconductor assembly. You will plan, verify and implement enhancements to meet quality, yield and cycle-time targets while coordinating with manufacturing, QA and equipment teams.

The role emphasizes data-driven problem solving, collaboration with NPI and Equipment Engineering, and delivering cost-reduction projects within defined timeframes to support ramp-up and mass production.

Qualifications

• Plan, evaluate, verify and execute procedures to ensure products meet customer requirements in terms of quantity, yield and cycle time.
• Provide interim and long-term corrective actions through troubleshooting, parameter optimization and defined process improvements.
• Liaise with internal (Manufacturing, QA) and external customers on smooth transition and implementation of defined process activities and improvements.
• Prepare reports and documentations with respect to process, materials, customers, & other specification as required.
• Work with NPI and Equipment Engineering to qualify new bonding materials , lead frames, tooling, and technologies for mass production ramp-up.
• Perform cost reduction and cycle time improvement projects from conceptualization, planning, execution and implementation within specific time frame.

Responsabilités

• Plan, evaluate, verify and execute procedures to ensure products meet customer requirements in terms of quantity, yield and cycle time.
• Provide interim and long-term corrective actions through troubleshooting, parameter optimization and defined process improvements.
• Liaise with internal (Manufacturing, QA) and external customers on smooth transition and implementation of defined process activities and improvements.
• Prepare reports and documentations with respect to process, materials, customers, & other specification as required.
• Work with NPI and Equipment Engineering to qualify new bonding materials , lead frames, tooling, and technologies for mass production ramp-up.
• Perform cost reduction and cycle time improvement projects from conceptualization, planning, execution and implementation within specific time frame.

Connaissances

Process improvement

Troubleshooting

Statistical analysis

Cross-functional collaboration

Formation

Bachelor's in Mechanical Engineering

Bachelor's in Material Science

Bachelor's in Electrical/Electronic Engineering

Bachelor's in Mechatronics

Bachelor's in Physics

Outils

FMEA

SPC

DOE (SAS JMP)

8D report

QC tools

Failure analysis

Description du poste

Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.

To provide interim and long-term corrective actions for any discrepancies through troubleshooting, parameter optimization and execution of defined process improvements.

Liaise with internal (Manufacturing, Equipment, QA) and external customers on smooth transition and implementation of defined process activities and improvements.

Prepare reports and documentations with respect to process, materials, customers, & other specification as required.

Work with NPI and Equipment Engineering to qualify new bonding materials , lead frames, tooling, and technologies for mass production ramp-up.

Perform cost reduction and cycle time improvement projects from conceptualization, planning, execution and implementation within specific time frame.

Job Requirements:

• Bachelor's degree or Diploma in Mechanical Engineering, Material Science, Electrical/Electronic Engineering, Mechatronics, or Physics.
• Minimum 2 years semiconductor assembly packaging experience in process development or process sustaining.
• QFN package Die Attach process experience preferred.
• Knowledgeable and application of Basic Problem Solving Tools and systems such as FMEA, Statistics (SPC), DOE (SAS Jmp), 8D report, QC Tools and others.
• Know-how in Failure Analysis and Reliability activities is an added advantage.
• Ability to work on 12-hour rotating shifts if required.