Process Associate Engineer

STATS ChipPAC Pte. Ltd.; Região Norte; On-site; BRL 60,000 - 90,000; Full time

Job summary

STATS ChipPAC Pte. Ltd. is seeking a production process professional to manage assigned production line processes and support advanced manufacturing in a semiconductor OSAT setting.

You will investigate defects, map issues, and ensure timely closure of reports while contributing to NPI runs and data compilation. The role includes creating recipes, machine buyoffs, SPC monitoring, and participating in cost savings, yield improvements, and productivity initiatives within a dynamic,

Qualifications

• Strong process orientation.
• Good Initiative & follow-up.
• Great problem-solving skill.

Responsibilities

• Manage the assigned processes in the production line.
• Investigate defects, map defects, compile affected lot lists, and close Inspection Reject Reports.
• Support NPI lots, engineering evaluation runs and data compilation.
• Create recipes, perform machine buyoff and monitor SPC.
• Participate in cost saving, yield improvement and productivity initiatives.

Skills

Strong process orientation

Initiative & follow-up

Problem-solving

Education

Diploma in Mechanical and Material Engineering or equivalent

Job description

About Stats ChipPAC

At Stats ChipPAC, we are at the forefront of the global semiconductor Outsourcing Assembly and Test (OSAT) industry, enabling tomorrow’s technology — from mobile devices to high-performance computing. Join our dynamic team where innovation, teamwork, and excellence drive our success. We are employing Advanced Manufacturing Technologies in our Wafer-Level Packaging operations with wide adoption of Automation, AI-enabled inspection and Autonomous Mobile Robots (AMR) as substitute to manual operations.

Scope of the Job:

• Manage the assigned processes in the production line.

• Responsible for firsthand investigation, defect mapping, affected lot list compilation and resolution of the problem, timely closure of Inspection Reject Report and lot disposition.

• Support NPI lot, engineering evaluation runs and data compilation.

• Responsible for recipe creation, machine buyoff and SPC monitoring.

• Participate in the cost saving, yield improvement and productivity activities.

Required Experience and Qualifications:

• Diploma in Mechanical and Material Engineering or equivalent.

• Experience in the following Semicon processes is preferred: Die/Package Pick & Place, Oven Reflow, Underfill, Molding, Plasma and Laser Mark, Back Grind, Die Sort, Laser Groove, Wafer Saw, AOI and Yield.

• Strong process orientation.

• Good Initiative & follow-up.

• Great problem-solving skill.

Why Join Us?

• Be part of an industry leader shaping the future of semiconductors

• Work with cutting-edge technologies and state-of-the- artwork equipment

• Clear career development pathways and mentorship from industry experts

• Dynamic, multicultural workplace that values collaboration and innovation

• Comprehensive benefits and employee-centric policies