(Senior) PVD Process Development Engineer

imec; Heverlee; On-site; EUR 75,000 - 110,000; Full time

Job summary

imec is seeking a highly motivated (Senior) PVD Process Development Engineer to advance physical vapor deposition for CMOS technologies in a state-of-the-art 300/200mm semiconductor fabrication environment in Belgium.

You will work with cross-disciplinary teams to develop and optimize PVD processes, characterize films using advanced metrology, and drive technology qualification from concept through implementation.

Qualifications

Responsibilities

• Tool selection and take part in tool procurement process for advance semiconductor technology development.
• Develop and optimize advanced PVD processes for CMOS, Logic, Memory and other cutting-edge technologies which includes: Metal deposition (standard and emerging materials); Barrier and liner layers; Contacts and interconnect applications; Advanced gate stack and BEOL metallization schemes.
• Lead process development activities from concept through technology qualification.
• Design and execute DOE (Design of Experiments) to establish process windows and achieve target performance metrics.
• Characterize deposited films using advanced metrology techniques including: XRD, XRR, SEM/TEM, XPS, AFM, Four-point probe, Stress and adhesion measurements, Ellipsometry.
• Analyze experimental data and derive physical understanding of film growth mechanisms, nucleation behavior, and plasma-material interactions.
• Collaborate with process integration teams to ensure successful implementation of developed processes into device process flows.
• Interface with equipment suppliers, material vendors, research partners, and customers as required in a dynamic multidisciplinary and multicultural environment.
• As opportunities arise, innovate new techniques of characterization that align with the Imec's technology roadmap.

Job description

What you will do

We are seeking a highly motivated (Senior) PVD Process Development Engineer to join our advanced semiconductor thin film deposition and diffusion technology development team (DDDEV). The successful candidate will play a key role in developing next-generation Physical Vapor Deposition (PVD) processes for advanced CMOS technology nodes, supporting cutting-edge logic, memory, and heterogeneous integration applications.

This position offers the opportunity to work in a state-of-the-art 300/200mm semiconductor fabrication environment, collaborating with integration, process, equipment, metrology, and reliability experts to enable future semiconductor technologies.

As a PVD process development engineer, you will be responsible for tools and processes:

• Tool selection and take part in tool procurement process for advance semiconductor technology development.
• Develop and optimize advanced PVD processes for CMOS, Logic, Memory and other cutting-edge technologies which includes:
  • Metal deposition (standard and emerging materials)
  • Barrier and liner layers
  • Contacts and interconnect applications.
  • Advanced gate stack and BEOL metallization schemes
• Lead process development activities from concept through technology qualification.
• Design and execute DOE (Design of Experiments) to establish process windows and achieve target performance metrics.
• Characterize deposited films using advanced metrology techniques including:
  • XRD
  • XRR
  • SEM/TEM
  • XPS
  • AFM
  • Four-point probe
  • Stress and adhesion measurements
  • Ellipsometry
• Analyze experimental data and derive physical understanding of film growth mechanisms, nucleation behavior, and plasma-material interactions.
• Collaborate with process integration teams to ensure successful implementation of developed processes into device process flows.
• Interface with equipment suppliers, material vendors, research partners, and customers as required in a dynamic multidisciplinary and multicultural environment.
• As opportunities arise, innovate new techniques of characterization that align with the Imec's technology roadmap.