Principal Thermal Solutions Engineer Onsite Belgium

Vinci; Brussel Hoofdstad; Hybride; EUR 120 000 - 180 000; Plein temps

Résumé du poste

Vinci engineers on-site at IMEC in Leuven, Belgium, drive adoption of Vinci’s platform among leading engineering teams. This high-impact senior technical role focuses on thermal and thermo-mechanical validation of package and device designs using Vinci’s software, in collaboration with IMEC engineers.

You will analyze steady-state and transient thermal behavior, stress, warpage, and reliability across semiconductor devices, guiding analyses and translating insights into actionable product

Qualifications

• Degree in Mechanical, Electrical, or related engineering field.
• 15+ years of hands-on thermal management, mechanical warpage, stress and reliability analysis using commercial software.
• Experience with semiconductor packaging, advanced packaging or foundry (warpage, 2.5D/3D IC).

Responsabilités

• Serve as the senior technical authority on thermal and thermo-mechanical simulation at IMEC.
• Own simulation setup, run test cases, and interpret results to demonstrate Vinci's value.
• Partner with sales to deliver product demonstrations and lead pre-sales discussions across Europe.
• Identify pain points and translate them into product improvements with Product/Engineering teams.
• Deliver technical training sessions to enable adoption of Vinci’s workflows.
• Represent Vinci at industry conferences and engage with customers and partners.
• Maintain awareness of competitive simulation technologies and market positioning.

Connaissances

Thermal management

Mechanical warpage

Stress analysis

Reliability analysis

Python

C++

Communication

Leadership

Customer-facing

Formation

Mechanical, Electrical or related engineering degree

Outils

FlowTherm

Cadence

Ansys

Abaqus

LS-DYNA

Description du poste

Vinci engineers on-site at IMEC in Leuven, Belgium, drive adoption of Vinci’s platform among leading engineering teams. This high-impact senior technical role focuses on thermal and thermo-mechanical validation of package and device designs using Vinci’s software, in collaboration with IMEC engineers.

You will analyze steady-state and transient thermal behavior, stress, warpage, and reliability across semiconductor devices, guiding analyses and translating insights into actionable product